| Allicdata Part #: | ATS-14E-38-C2-R0-ND |
| Manufacturer Part#: |
ATS-14E-38-C2-R0 |
| Price: | $ 6.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X22.86MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-14E-38-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.52888 |
| 30 +: | $ 5.22186 |
| 50 +: | $ 4.91463 |
| 100 +: | $ 4.60744 |
| 250 +: | $ 4.30028 |
| 500 +: | $ 3.99312 |
| 1000 +: | $ 3.91632 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-14E-38-C2-R0 is an advanced thermal-heat sink designed for computer and other electronics applications. It is designed to efficiently dissipate the heat that is generated during the operation of electronic devices. The heat sink is manufactured from high-grade aluminum alloy and has a laser-cut fin array that creates more surface area for better heat dissipation. The ATS-14E-38-C2-R0 also has an offset design which increases airflow inside the heat sink, further improving heat dissipation.
The ATS-14E-38-C2-R0 is designed to be easy to install and mount. The heat sink comes pre-assembled with screws and a brackets, allowing for quick and easy installation. It is also compatible with most CPUs, GPUs, RAM modules, and other components that generate heat during operation. The offset design also makes it easier to install and mount the heat sink as it allows for more flexibility in positioning.
The ATS-14E-38-C2-R0 is designed to provide superior heat dissipation compared to other conventional heat sinks. The heat sink utilizes the latest in advanced cooling technology, including an offset fin array and laser cut design. These features allow the heat sink to more effectively spread the heat across its surface, allowing it to dissipate heat efficiently. It also features an optimized fin array which helps increase the surface area available for heat dissipation. The ATS-14E-38-C2-R0 can be used to cool down a variety of electronic components, from CPUs to GPUs, giving your system the best possible cooling performance.
The working principle of the ATS-14E-38-C2-R0 is simple. The heat generated by the components is transferred to the heat sink through convection. As the heat is dissipated, the heat sink cools down, allowing the system to be more efficient. The ATS-14E-38-C2-R0 also utilizes an advanced airflow system, which utilizes a number of air channels which further disperse the heat across the heat sink. This allows for a more efficient heat dissipation, and also helps to increase the overall life of the components.
Overall, the ATS-14E-38-C2-R0 is an advanced thermal-heat sink designed for computer and other electronic applications. It features a laser-cut fin array and an offset design for improved heat dissipation, as well as an optimized fin array for increased surface area. Additionally, the heat sink has an advanced airflow system that allows for better heat dissipation. This allows the ATS-14E-38-C2-R0 to provide superior cooling performance for your system.
The specific data is subject to PDF, and the above content is for reference
ATS-14E-38-C2-R0 Datasheet/PDF