| Allicdata Part #: | ATS-14E-63-C1-R0-ND |
| Manufacturer Part#: |
ATS-14E-63-C1-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14E-63-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an important part of any cooling system for electronics. The ATS-14E-63-C1-R0 is a type of thermal-heat sink that is designed to regulate the temperature of an electronic device. Understanding the application field and working principle of the ATS-14E-63-C1-R0 can help in finding the best product to meet specific cooling needs.
What is a Thermal - Heat Sink?
A thermal-heat sink is a device that is designed to improve the efficiency of the cooling system of an electronic component by dissipating the heat away from the surface. This is done by providing a large surface area for heat dissipation. Heat is conducted away from the component by passing into the fins of the heat sink, which allows for much greater surface area than would be possible if the heat were dissipated directly from a component.
What is the Application Field for the ATS-14E-63-C1-R0?
The ATS-14E-63-C1-R0 is designed for use in a variety of electronic components in a variety of industries, including but not limited to, consumer, industrial, automotive, and military markets. The ATS-14E-63-C1-R0 is a high thermal conductivity aluminum heat sink designed to dissipate heat away from the surface of components quickly and efficiently. This product is specifically designed for power semiconductor components such as IGBT\'s, MOSFETs, diodes, and thyristors.
What is the Working Principle of the ATS-14E-63-C1-R0?
The ATS-14E-63-C1-R0 is a passive heat sink which relies on natural convection to dissipate heat away from the surface. The product is made from high thermal conductivity aluminum which allows it to absorb and dissipate the heat efficiently. The fins on the ATS-14E-63-C1-R0 provide increased surface area which allows for better heat dissipation. The ATS-14E-63-C1-R0 is designed to be used with an air moving device such as a fan or blower in order to improve the performance of the heat sink.
The ATS-14E-63-C1-R0 is also designed to be compatible with a wide range of mounting hardware. This includes four different mounting holes which allow for easy installation on a variety of components. The product also includes an extended mounting bracket which allows for greater heat dissipation by removing the need for an additional component. The ATS-14E-63-C1-R0 also includes a copper base to further improve the performance of the thermal-heat sink.
Conclusion
The ATS-14E-63-C1-R0 is a thermal-heat sink that is designed to effectively dissipate heat away from components quickly and efficiently. It is designed for use with a variety of electronic components and in different industries. The ATS-14E-63-C1-R0 relies on natural convection to dissipate heat along with a copper base and mounting hardware to increase its effectiveness. Understanding the application field and working principle of the ATS-14E-63-C1-R0 can help in finding a product that best meets specific cooling needs.
The specific data is subject to PDF, and the above content is for reference