| Allicdata Part #: | ATS24187-ND |
| Manufacturer Part#: |
ATS-14E-64-C2-R0 |
| Price: | $ 4.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14E-64-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.13910 |
| 10 +: | $ 4.02507 |
| 25 +: | $ 3.80167 |
| 50 +: | $ 3.57802 |
| 100 +: | $ 3.35437 |
| 250 +: | $ 3.13075 |
| 500 +: | $ 2.90712 |
| 1000 +: | $ 2.85122 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.39°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are thermal management components which are designed to absorb and dissipate excess heat from electronic components and transfer to the surrounding environment. Heat sinks are extensively used in modern electronic devices to maintain a regulated temperature when the device is in operation. The ATS-14E-64-C2-R0 thermal management device falls under the category of heat sinks and has a conduction cooling system, consisting of a thermal plate interface, mounted on top of a heatsink. It is designed to provide an efficient solution for cooling high-power light emitting diode (LED) and other light emitting components.
The ATS-14E-64-C2-R0 has a unique feature that allows it to dissipate heat twice as effectively as traditional cooling methods. It is composed of a metal plate that has two conductive fins on either side and a fan placed between them. This configuration allows the device to absorb heat from the source component and transfer it to the fan. The fan then dissipates the heat to the surrounding environment through natural convection. The metal plate also serves as a thermal shunt, dissipating any residual heat from the component to the environment.
The ATS-14E-64-C2-R0 is typically used in applications such as customer electronics, automotive LED lighting, aviation lighting, and electronic product enclosures. It is also used in high-power systems such as computers, servers, and gaming consoles. The device has a very low profile which makes it suitable for tight compact spaces such as laptops or medical electronics. The overall design of the ATS-14E-64-C2-R0 ensures that it provides effective thermal management with minimal noise levels.
The device also employs advanced thermal management design techniques to ensure the highest efficiency and reliability. Firstly, the device incorporates a base plate interface with a fine grid pattern. This allows for efficient heat transfer from the component to the device, as well as better airflow across the fins. Secondly, the device utilizes a unique vertical fin design that enables improved heat dissipation from the center of the fins. Finally, the device has a patented Direct Flow architecture, which results in maximum airflow and improved air velocity across the fins. This ensures that heat is constantly dissipated from the component, thus preventing it from overheating.
The ATS-14E-64-C2-R0 is an extremely reliable and efficient thermal management solution for LED and other advanced light emitting components. The device is also designed to be extremely compact and lightweight, which makes it suitable for applications where space is a premium. The device utilizes advanced thermal management techniques to ensure optimal thermal performance and reliability. It is an ideal choice for applications that require a reliable and efficient cooling solution.
The specific data is subject to PDF, and the above content is for reference