| Allicdata Part #: | ATS-14E-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-14E-73-C1-R0 |
| Price: | $ 3.10 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14E-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks have long been used in a variety of electronic applications to dissipate heat and protect components from damage due to overheating. The ATS-14E-73-C1-R0 is a high-performance heat sink designed to provide superior cooling performance in areas with limited space. This heat sink is especially suitable for cooling high-powered semiconductor devices and other thermal management applications.
The ATS-14E-73-C1-R0 is constructed from top-grade aluminum extrusion, which offers maximum thermal efficiency and durability in demanding conditions. The heat sink has an optimized fin design that is designed to maximize the air-flow and heat transfer efficiency to ensure optimum thermal performance. This heat sink can manage up to a maximum power dissipation of 14W, making it suitable for a variety of applications, including power supplies, fan motors, and LED lighting.
The ATS-14E-73-C1-R0 is designed to be compact, yet highly efficient. It measures just 73mm x 14mm x 29mm, making it suitable for a variety of restricted spaces. The heat sink features an over-sized baseplate that ensures effective contact between the device and the heat sink, and provides improved thermal transfer efficiency. The heat sink is also coated with a matte black coating to reduce chances of corrosion.
The ATS-14E-73-C1-R0 utilizes the forced convection technique to cool semiconductor devices. It uses a fan to pull in cool air, which is then used to dissipate the heat away from the device. The fan draws air through the fins of the heat sink, which has been optimized to maximize air-flow while also providing effective cooling performance. This in turn helps to maintain the temperature of the device within the desired range.
In order to ensure optimal performance, the ATS-14E-73-C1-R0 heat sink also comes with adjustable mounting clips. These clips allow for the heat sink to be firmly secured and easily adjusted for correct alignment and secure fitting. The clips also provide good heat dissipation and uniform thermal distribution, while also allowing for a quick installation. Furthermore, these clips are designed to be vibration resistant, making them suitable for use in a variety of environments.
The ATS-14E-73-C1-R0 is an effective thermal management solution for high-powered semiconductor devices and other electronic components. With its compact size and efficient cooling capabilities, this heat sink is able to provide superior thermal performance in areas with limited space and can help to ensure the longevity of vital electronic components.
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