| Allicdata Part #: | ATS24197-ND |
| Manufacturer Part#: |
ATS-14E-74-C2-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14E-74-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.20040 |
| 10 +: | $ 3.11472 |
| 25 +: | $ 3.03055 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has always been a critical issue in the design of electronics and other systems. Heat generated by components, particularly processors, must be dissipated in order to prevent premature failure of the components or shorten the life expectancy of the product. In order to dissipate heat efficiently, designers often employ a combination of thermal devices including fans, heat sinks and heatsinks. One such device is the ATS-14E-74-C2-R0 heatsink, which is specifically designed to address the thermal management needs of computer processors.
The ATS-14E-74-C2-R0 heat sink is a specific model of heatsink manufactured by Alpha & Omega Technologies and is available in a variety of different sizes. It is made using extruded aluminum for the fins and has a base of copper or aluminum, depending on the model. This heatsink is designed to be mounted on various processor components including Socket A (Socket 462), Socket 478, Socket 754, and Socket 939. It can also be used for LGA 775, LGA 1155 and LGA 1156 with the addition of a special adaptor. The combination of aluminum fins and copper/aluminum base ensures excellent heat transfer and efficient cooling for your processor.
The ATS-14E-74-C2-R0 heatsink is designed with a slotted mounting hole pattern in order to fit onto various processors. It is also designed with a clip-on retention system which helps ensure that the heatsink is securely fastened to the processor. Additionally, the heatsink has a grease groove which helps ensure that the heatsink and processor both remain adequately lubricated during operation. The combination of solid construction and innovative features makes the ATS-14E-74-C2-R0 a highly capable heatsink for cooling your processor or other components.
The ATS-14E-74-C2-R0 is designed to take advantage of airflow to help dissipate heat. The aluminum fins on the heatsink act as an extension of the processor’s surface area to allow additional air to come in contact with the processor. This helps dissipate much of the heat from the processor and enables it to run more efficiently and for longer. Additionally, the fins and base are designed to direct airflow over the processor in order to ensure maximum efficiency of heat dissipation. As a result, the ATS-14E-74-C2-R0 heatsink is one of the best solutions for cooling processors in today’s electronic market.
In addition to its cooling capabilities, the ATS-14E-74-C2-R0 also offers a number of other features that make it a great choice for processor and system cooling. It is designed to allow for easy installation and removal, and can be mounted in both horizontal and vertical positions. Additionally, the heatsink comes with a fan guard that helps protect the processor from potential damage. Provision is also made for a fan to be attached to the heatsink in order to increase cooling efficiency.
The ATS-14E-74-C2-R0 heat sink is an effective and economical solution for processor and system cooling. It offers superior cooling efficiency and ease of installation without sacrificing durability or long-term performance. Its combination of aluminum fins, copper/aluminum base, and efficient airflow pattern make it one of the best heatsinks available today for cooling processors and other components.
The specific data is subject to PDF, and the above content is for reference