| Allicdata Part #: | ATS-14E-87-C1-R0-ND |
| Manufacturer Part#: |
ATS-14E-87-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14E-87-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-14E-87-C1-R0 is a high rated Thermal – Heat Sink designed for dissipation of heat in any applications requiring high power densities and temperatures. It is an advanced thermal solution that offers low thermal resistance, high thermal transfer capability and high temperature performance. The ATS-14E-87-C1-R0 is ideal for applications that require a reliable and high performing thermal solution.
The ATS-14E-87-C1-R0 consists of a copper base plate, a heat sink fin, and a fan. The copper base plate is used for attachment to the device which is being cooled. The heat sink fin is a aluminum extrusion attached to the base plate and is specifically designed to conduct heat away from the device; the fin is also designed for maximum airflow. The fan is used to provide additional cooling and to pull the heat away from the heat sink.
The working principle of the ATS-14E-87-C1-R0 is based on thermodynamics. It works to draw the heat out of the device by increasing the surface area of the heat sink fin. This creates an area of low pressure, which in turn draws in more cooler air. This cooler air is then forced over the heat sink fin, taking the heat away from the device and dissipating it into the atmosphere. The fan is also used to increase the air circulation, further assisting in the cooling process.
The ATS-14E-87-C1-R0 has a wide range of application fields. It is suitable for a variety of electronic components such as CPUs, GPUs, FPGAs, ASICs, and power transistors. Additionally, it is also suitable for LED lighting and power systems. The ATS-14E-87-C1-R0 is also suitable for automotive, industrial and aerospace applications requiring hot-spot cooling. Its low profile design and high heat transfer capabilities make it suitable for applications with limited space constraints.
The ATS-14E-87-C1-R0 is designed for superior performance and reliable operation in any application requiring cooling. Its high thermal transfer capabilities and low thermal resistance ensures minimal heat dissipation and maximum cooling. Additionally, the fan is designed to provide maximum airflow, ensuring optimal performance. The ATS-14E-87-C1-R0 is thus ideal for any applications requiring high power densities and temperatures.
The specific data is subject to PDF, and the above content is for reference