| Allicdata Part #: | ATS-14F-09-C1-R0-ND |
| Manufacturer Part#: |
ATS-14F-09-C1-R0 |
| Price: | $ 3.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14F-09-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.17394 |
| 30 +: | $ 3.08826 |
| 50 +: | $ 2.91677 |
| 100 +: | $ 2.74516 |
| 250 +: | $ 2.57363 |
| 500 +: | $ 2.48783 |
| 1000 +: | $ 2.23047 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are essential components of any electronics system and are used to rapidly dissipate the energy produced by the electronic components. The ATS-14F-09-C1-R0 is a specific type of heat sink that is designed for applications where space is a critical factor, such as enclosure systems. This heat sink is made from aluminum and is highly efficient in dissipating thermal energy. In this article, we will discuss the various applications and the working principle of the ATS-14F-09-C1-R0 heat sink.
Applications
The ATS-14F-09-C1-R0 heat sink is a low profile design which makes it ideal for applications that require minimal space. It is typically used in enclosure systems where there are limited air flow opportunities or for components with a high power density. Additionally, this heat sink can be used in applications that need to dissipate large amounts of heat in a short amount of time.
Due to its low profile, the ATS-14F-09-C1-R0 heat sink can also be used in applications such as LED lighting, data centres, and industrial applications. Additionally, this heat sink is suitable for applications that require high-density components, such as digital signal processing and CPU cooling. Finally, the heat sink can be used in applications where there is a need to rapidly dissipate heat, such as in power supplies, emergency lighting, automotive electronics, and medical devices.
Working Principle
The ATS-14F-09-C1-R0 heat sink works on the principle of convective cooling. This type of cooling uses air to transfer heat away from the source. The design of the heat sink includes fins and various other features which are designed to maximize the surface area, thus increasing the efficiency of the convective cooling process. As the air flows through the fins and over the surface of the heat sink, it picks up the heat from the source and dissipates it to the surrounding environment.
The ATS-14F-09-C1-R0 heat sink is also designed to dissipate heat from the small profile components frequently found in enclosure systems. The design of the heat sink includes features such as integrated heat transfer plates and air channels. These features help to create a more efficient transfer of heat away from the components to the environment.
Conclusion
The ATS-14F-09-C1-R0 is an effective heat sink for applications where space is a critical factor. It is designed to dissipate thermal energy using the principle of convection cooling and is ideal for applications that require highly efficient cooling. Additionally, the heat sink is suitable for components with a high power density and can be used in various applications, such as LED lighting, data centres, and industrial applications.
The specific data is subject to PDF, and the above content is for reference