ATS-14F-108-C3-R1 Allicdata Electronics
Allicdata Part #:

ATS-14F-108-C3-R1-ND

Manufacturer Part#:

ATS-14F-108-C3-R1

Price: $ 4.98
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X40X12.7MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-14F-108-C3-R1 datasheetATS-14F-108-C3-R1 Datasheet/PDF
Quantity: 1000
10 +: $ 4.48812
30 +: $ 4.23864
50 +: $ 3.98929
100 +: $ 3.73993
250 +: $ 3.49061
500 +: $ 3.24127
1000 +: $ 3.17894
Stock 1000Can Ship Immediately
$ 4.98
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.969" (50.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 27.12°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is one of the primary ways of controlling the temperature of an electronic device. Heat sinks, the most common form of passive thermal management, are used to pull heat away from the component and disperse it in the air. ATS-14F-108-C3-R1 is one such heat sink, designed to remove heat from components that generate a high amount of heat.

The ATS-14F-108-C3-R1 is composed of extruded aluminum with efficient grooves and fins that provide maximum heat dissipation. It is L-shaped in profile, with a footprint measuring 108mm (L) x 59mm (W) x 22mm (H). The mount holes can accommodate a 6-32 screw, and the heatsink is sold with screws for easy installation. The product has a black anodized finish, giving it a sleek and professional appearance that will suit most electronic components.

At the heart of the ATS-14F-108-C3-R1 are its specially designed fins. They’re designed to allow maximum air-flow, which helps to disperse the heat away from the component more efficiently. The fins also have a slightly radial shape, which increases the surface area and helps to dissipate the heat more evenly. The fins are made of high-grade aluminum, which is strong and can handle the stresses of thermal cycling without warping.

The ATS-14F-108-C3-R1 is also designed with a low-profile profile so that it can fit in smaller or tight spaces without crowding out other components. This is especially useful when designing electronic devices that must be very compact. The alloy aluminum construction helps to dissipate the heat quickly, and the black anodized finish helps to protect against corrosion and wear.

The ATS-14F-108-C3-R1’s application field is wide, ranging from components in industrial or commercial electronics to gaming computers, server racks, home media centers, metal fabrication and more. All in all it can be used for any application where heat must be dissipated away from electronic components. The heatsink can also be mounted in a variety of configurations to deal with a wider range of temperatures and performance.

In conclusion, the ATS-14F-108-C3-R1 is an excellent example of an effective heat sink, designed to keep your electronic components at optimal temperatures. With its attractive design, low-profile design, and wide application field, it makes an ideal addition to any electronic device that needs to stay cool.

The specific data is subject to PDF, and the above content is for reference

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