Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.58°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-14F-117-C3-R0 application field and working principle

Introduction

The ATS 14F-117-C3-R0 is an effective thermal management solution for electronic devices. It is a highly efficient heat sink made from aluminum and designed with a fin construction and integrated fan for optimal heat dissipation. The heat sink also includes a digital temperature control to regulate the temperature of the device. This heat sink is a great way to minimize the risk of overheating and reduce operating costs.

Principle of Heat Sinks

Heat sinks are essential components in the thermal management of electronic devices. Heat is generated by the components inside the device and must be dissipated in order to keep temperatures at safe levels. Heat sinks work by transferring the heat away from the heat-generating components and into the surrounding environment. The heat sink is usually made of a metal with good thermal conductivity such as aluminum, copper, or even magnesium.

Application Field of the ATS-14F-117-C3-R0

The ATS 14F-117-C3-R0 can be used in a variety of applications. It is an ideal choice for applications where maximizing space is important. It can also be used for applications that have limited airflow, as the integrated fan ensures maximum heat dissipation even in cramped spaces. Its digital temperature control ensures that temperatures remain within safe thresholds. This makes it an excellent choice for applications where overheating is an issue, as it ensures that temperatures stay within optimal ranges at all times. The low-profile design allows for easy installation and allows for the heat sink to be used in tight spaces. This makes it an ideal choice for embedded applications as well.

Conclusion

The ATS-14F-117-C3-R0 is a highly efficient heat sink designed for optimal heat dissipation. It features a fin structure design and integrated fan, as well as temperature control for maximum efficiency. The low-profile design and digital temperature controls make it an ideal choice for space-limited applications and embedded applications where crucial components must remain at safe temperatures. All of these features make the ATS deep sink an ideal thermal management solution for a variety of electronic devices.

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