| Allicdata Part #: | ATS-14F-161-C1-R0-ND |
| Manufacturer Part#: |
ATS-14F-161-C1-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14F-161-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.72°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-14F-161-C1-R0 thermal-heat sink is designed to provide maximum heat-dissipation efficiency. It is a reliable and efficient solution for electronics that are prone to overheating and for processors that require a cooling method to keep them functioning reliably and efficiently. The ATS-14F-161-C1-R0 is designed for applications including computer heat-sinks, power devices, power transistors, control relays, and power amplifiers.
The design of the ATS-14F-161-C1-R0 consists of a case with an integrated fan to provide cooling air flow, four copper heat pipes to transfer heat away from the processor, and a aluminum heat sink to dissipate the heat. The aluminum heat sink is designed to be used in a vertical orientation, to ensure even distribution of heat, and minimize turbulence in the air flow. The fan is designed to be adjustable to reduce noise, while providing maximum cooling efficiency.
The heat pipes in the ATS-14F-161-C1-R0 are designed to transfer the heat away from the processor to the aluminum heat sink with minimal power requirements. The heat pipes have an anodized copper core that is filled with a liquid which is designed to efficiently transfer heat away from the processor. The heat is then transferred to the aluminum heat sink where the heat is dissipated from the fins of the heat sink.
The aluminum heat sink is designed to be very efficient at dissipating heat. The fins of the heat sink are designed to increase the surface area of the aluminum to allow for maximum heat dissipation. The heat sink is also designed to be optimized for convection cooling, by having a pattern of louvers and fins. This helps to ensure that the air passing through the heat sink is directed at a low angle to the fins for maximum cooling efficiency.
The ATS-14F-161-C1-R0 thermal-heat sink is designed to provide cooling for electronics that are prone to overheating, and is often used in processors that need cooling to prevent overheating. The design combines a fan, heat pipes, and an aluminum heat sink to provide efficient heat dissipation. The heat pipes transfer the heat away from the processor to the aluminum fins with minimal power requirements. The aluminum heat sink optimizes convection cooling to ensure maximum heat dissipation. Together, the ATS-14F-161-C1-R0 thermal-heat sink provides a reliable and efficient cooling solution for electronics and processors.
The specific data is subject to PDF, and the above content is for reference