
Allicdata Part #: | ATS-14F-169-C1-R0-ND |
Manufacturer Part#: |
ATS-14F-169-C1-R0 |
Price: | $ 3.27 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 30X30X10MM R-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 2.97234 |
30 +: | $ 2.89170 |
50 +: | $ 2.73105 |
100 +: | $ 2.57040 |
250 +: | $ 2.40975 |
500 +: | $ 2.32942 |
1000 +: | $ 2.08845 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 15.66°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
A thermal-heat sink is an essential component used for heat dissipation in electrical and electronic equipment. The ATS-14F-169-C1-R0 thermal-heat sink is designed to effectively cool electrical and electronic components by transferring heat from the components to the external environment. It is manufactured by a reliable and experienced manufacturer of thermal-heat sinks and other thermal management products.
The main components of the ATS-14F-169-C1-R0 thermal-heat sink are the printed circuit board (PCB) base, fins, and covering clip. The PCB base is made of a thermally conductive material and is attached to the electronic component which requires cooling. Heat is generated by the component and is transferred to the PCB base. The fins of the thermal-heat sink then act as a heat sink, transferring the heat away from the PCB base and into the environment.
The fin design of the ATS-14F-169-C1-R0 includes a high-performance, heat-dissipating heat sink, with three vertical fins that are spaced 7mm apart. This maximizes the surface area and increases heat dissipation as the air flows through the fin design and dissipates the heat. The fins consist of aluminum alloy material which ensures excellent thermal conductivity.
The covering clip of the ATS-14F-169-C1-R0 ensures all components are secured in their respective position within the thermal-heat sink and that the fins remain in place. The clip is made of a corrosion-resistant stainless steel, and its design ensures that it fits perfectly and securely on all ATS-14F-169-C1-R0 models.
The ATS-14F-169-C1-R0 thermal-heat sink is designed to perform optimally in temperatures between 0°C and 50°C. It is highly reliable, durable, and efficient and occupied a very small amount of space. It is also flame retardant, making it suitable for use in areas with high temperatures.
Other features of the ATS-14F-169-C1-R0 thermal-heat sink include: efficient operation even at low operating currents; thermal conductivity is improved by integrating multiple layers of copper in the center of the fins; its compact design enables easy installation in even the most confined spaces; and its high-quality, corrosion-resistant materials provide long-term durability. Because it is manufactured with quality materials, the ATS-14F-169-C1-R0 thermal-heat sink offers superior reliability and performance.
The ATS-14F-169-C1-R0 thermal-heat sink is suitable for applications in a wide range of industries, including aerospace, automotive, and medical. It is also ideal for a variety of electronic components and devices, such as LED modules, power modules, connectors, amplifiers, and voltage regulators. Furthermore, its advanced design and high-performance capabilities make it a great choice for thermal management solutions for consumer electronics products.
In summary, the ATS-14F-169-C1-R0 thermal-heat sink is a reliable, effective, and efficient solution for cooling electronic components and devices. With its high-performance design and heat-dissipating features, it is an excellent option for thermal management applications in different industries.
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