
Allicdata Part #: | ATS-14F-171-C1-R0-ND |
Manufacturer Part#: |
ATS-14F-171-C1-R0 |
Price: | $ 3.42 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 30X30X20MM R-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.11472 |
30 +: | $ 3.03051 |
50 +: | $ 2.86209 |
100 +: | $ 2.69375 |
250 +: | $ 2.52542 |
500 +: | $ 2.44124 |
1000 +: | $ 2.18870 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.790" (20.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
Heat sinks are used to transfer thermal energy away from heavily loaded electronics by dispersing heat into the surrounding environment. The ATS-14F-171-C1-R0 heat sink is a highly efficient thermal solution for electronic components and systems in extreme ambient environments. It offers outstanding cooling performance through a unique design which enables maximum heat transfer and air flow. The heat sink is rated to operate in temperatures up to 70°C.
The ATS-14F-171-C1-R0 provides an optimized design to ensure maximum cooling performance and consists of a single-piece extruded aluminum heat sink. The design of the aluminum fins has been optimized to maximize air flow and surface area for effective heat transfer. The heat sink also has a black anodized finish for improved corrosion resistance, and the unit is pre-assembled with an integrated mounting bracket.
The ATS-14F-171-C1-R0 is designed to dissipate heat generated by electronic components and systems. The heat sink is designed for applications that require high performance thermal solutions and have limited space. The heat sink is engineered for optimal thermal performance in extreme ambient environments and has a high-efficiency design that eliminates the need for additional thermal management components. The ATS-14F-171-C1-R0 is suitable for a range of applications including medical and industrial equipment, consumer electronics, telecommunications, data centers, and automotive.
The ATS-14F-171-C1-R0 can be used in a variety of configurations and can be combined with a range of other heat sinks for larger thermal loads. The heat sink is designed to be easily installed and comes with all necessary mounting hardware. The unit is available in a variety of sizes and shapes to suit various applications. The heat sink is also RoHS compliant and is certified to meet the requirements of international safety certifications.
The ATS-14F-171-C1-R0 works by conducting thermal energy away from the part to be cooled and dissipating it into the atmosphere. It is typically used with a fan to improve the overall efficiency of the setup, as the air from the fan increases the heat dissipation rate. This allows the unit to transfer more heat away from the electronic component and reduce its operating temperature.
Heat sinks are an essential part of electronics and their efficient operation is critical for the protection and reliability of the system. The ATS-14F-171-C1-R0 is a highly efficient and reliable heat sink that offers excellent cooling performance in extreme ambient environments. Its optimized design ensures maximum thermal performance and eliminates the need for additional thermal management components. The heat sink is suitable for a range of applications including medical and industrial equipment, consumer electronics, telecommunications, data centers, and automotive.
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