| Allicdata Part #: | ATS-14F-171-C3-R0-ND |
| Manufacturer Part#: |
ATS-14F-171-C3-R0 |
| Price: | $ 3.73 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14F-171-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.38814 |
| 30 +: | $ 3.29658 |
| 50 +: | $ 3.11346 |
| 100 +: | $ 2.93026 |
| 250 +: | $ 2.74713 |
| 500 +: | $ 2.65555 |
| 1000 +: | $ 2.38083 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-14F-171-C3-R0 is a high-performance thermal solution designed to reduce operating temperatures by dissipating heat generated by components that require cooling. It is a type of heat sink, which is a device that facilitates the transfer of heat from one location, often a hot surface, to another, often a cooler surface. When installed with an appropriate fan or other cooling device, the ATS-14F-171-C3-R0 can help maintain a low temperature in a wide variety of electronic and electrical systems.
The ATS-14F-171-C3-R0 provides high thermal conductivity and low thermal resistance, allowing maximum heat transfer from hot components to the terminal. This allows the user to operate the device at higher power levels and operating temperatures. The ATS-14F-171-C3-R0’s integrated heat pipe design also helps to spread the heat over an increased surface area, which increases the overall efficiency of the device.
The ATS-14F-171-C3-R0 is primarily used in applications where components are exposed to extreme temperatures, such as high performance computers, industrial systems, and military applications. It is also well-suited to applications that require high thermal performance, such as LED lighting, automotive, and medical systems. The device has a short working life of up to 15 years, however, it offers superior cooling performance.
The working principle behind the ATS-14F-171-C3-R0 thermal solution is based on the concept of thermal conductivity and convection. Thermal conductivity is a physical property that refers to the rate at which heat is transferred through a material. The ATS-14F-171-C3-R0 utilizes an efficient combination of thermal conductivity and convection to effectively dissipate heat away from hot components. The internal heat pipes contain a liquid (typically water or glycol) which quickly carries heat away from the heat-generating component. This liquid then evaporates, and its vapor transfers the heat to the external fins which then act as a heat sink to draw the heat away from the component and disperse it into the surrounding air.
The ATS-14F-171-C3-R0 is an effective thermal solution for high performance systems, and offers a broad range of benefits. The device is lightweight and durable, and it is capable of dissipating large amounts of heat in a short period of time. Its efficient operation helps to maintain low operating temperatures, and its integrated design allows for easy installation and maintenance. The ATS-14F-171-C3-R0 is an ideal choice for applications requiring high thermal performance and reliability.
The specific data is subject to PDF, and the above content is for reference