| Allicdata Part #: | ATS-14F-199-C3-R0-ND |
| Manufacturer Part#: |
ATS-14F-199-C3-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X6MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14F-199-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Modern day technology has made tremendous strides in revolutionizing the way we use energy. The application and utilization of thermal dissipation components has become increasingly important in the data center. The ATS-14F-199-C3-R0 is an effective thermal solution to reduce the thermal load of high density computing devices. In this article, we will explore the application field and working principle of the ATS-14F-199-C3-R0 thermal-heat sink component.
The ATS-14F-199-C3-R0 is a 200 watt, high performance, compact, aluminum heat sink designed to dissipate excess heat generated by electronic components. It is highly effective in reducing the thermal load within high-density computing clusters, and other high-powered electronic systems. The ATS-14F-199-C3-R0’s utilization of integrated air-forced thermal solutions ensures that the highest possible thermal dissipation performance is achieved.
The ATS-14F-199-C3-R0 features a lightweight aluminum design without any additional fans or other mechanical component requirement. It consists of a strong, rigid base that supports an open-frame aluminum core with channels embedded throughout for high-efficiency heat transfer. This allows for superior air-forced thermal transfer as hot air is conducted away, ensuring that no significant thermal buildup ever persists.
In addition, the ATS-14F-199-C3-R0 is designed with a three-rod design that evenly distributes load along its contact surface. This provides maximum surface contact along with optimal airflow. This three-rod design also helps to provide easy installation while also maximizing heat transfer and helping reduce the overall thermal load. This ensures that the overall temperature of the data center is maintained at a steady level.
The ATS-14F-199-C3-R0’s ability to reduce the thermal load of high-density computing clusters and other high-powered systems makes it a great choice when selecting thermal dissipation solutions. It is highly energy efficient, able to dissipate up to 200 watts while still providing superior air-forced thermal transfer. Its three-rod design also provides easy installation and maximum heat transfer with minimal thermal buildup. The ATS-14F-199-C3-R0’s superior air-forced thermal transfer and lightweight aluminum design make it an ideal choice for high-density computing clusters and other high-powered electronic systems.
The specific data is subject to PDF, and the above content is for reference