ATS-14F-20-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.21°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction to ATS-14F-20-C3-R0

ATS-14F-20-C3-R0 is a type of thermal - heat sinks. Heat sinks are components designed to dissipate heat away from electronic devices or components. They are essential components in modern electronics, such as computers, electronic devices, and other electronic components. Heat sinks play an important role in allowing electronic components to work efficiently and reliably. Without them, the components would either overheat or suffer from poor performance.

Application Field of ATS-14F-20-C3-R0

ATS-14F-20-C3-R0 is primarily used in telecommunications and information technology for RF and optical communication networks. It is also suitable for medical, consumer electronics, automotive and industrial applications. The thermal - heat sinks have a high performance, great design and reliable cooling. ATS-14F-20-C3-R0 has a high power capacity that makes it effective for applications that involve high energy consumption. It is also compatible with various types of electronic components.

Working Principle of ATS-14F-20-C3-R0

The working principle of ATS-14F-20-C3-R0 thermal - heat sinks is based on the transfer of heat along a temperature gradient from one point to another. Heat is dissipated from the electronics components by convection, radiation and conduction. Heat is created in electronic components and dissipated through the thermal - heat sinks. Heat is transferred to the environment by radiation, convection or conduction.Firstly, the thermal - heat sinks absorb heat from the components using a heat pipe, which is a specialized conduit filled with a heat-transfer liquid. The heat is then transferred to the heat sink via the heat pipe. The heat is then dissipated to the environment through either radiative, convective or conductive heat transfer methods.Radiation is the transfer of heat through electromagnetic waves and is the principal means by which heat is dissipated from the heat sink to the environment. Convection is the transfer of heat via moving air or other fluids. Conduction is the direct transfer of heat through physical contact.For maximum cooling efficiency, the thermal - heat sinks must be made of a material that has good thermal conductivity. Aluminum is the most common material used for thermal - heat sinks, as it has good thermal conductivity and is lightweight and relatively low-cost. Other materials such as copper and other metals can also be used. Additionally, the surface of the heat sink should also be designed to maximize surface area, as this maximizes the rate of heat dissipation.

Conclusion

In conclusion, ATS-14F-20-C3-R0 is a type of thermal - heat sinks that are used to dissipate heat away from electronic components. It has a high power capacity, making it suitable for many applications. The working principle of ATS-14F-20-C3-R0 is based on the transfer of heat along a temperature gradient from one point to another, and is achieved through radiation, convection or conduction. Heat is absorbed from the components by a heat pipe and is then dissipated to the environment. The thermal - heat sinks are usually made of aluminum due to its good thermal conductivity and lightweight properties, and the surface should be designed to maximize surface area for maximum cooling efficiency.

The specific data is subject to PDF, and the above content is for reference