ATS-14F-29-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-14F-29-C1-R0-ND

Manufacturer Part#:

ATS-14F-29-C1-R0

Price: $ 6.83
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X20MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-14F-29-C1-R0 datasheetATS-14F-29-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 6.14187
30 +: $ 5.80083
50 +: $ 5.45958
100 +: $ 5.11831
250 +: $ 4.77709
500 +: $ 4.43586
1000 +: $ 4.35056
Stock 1000Can Ship Immediately
$ 6.83
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.56°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Introduction

Heat sinks are thermal devices used to dissipate heat from electronic components and systems in order to protect them from damage. The ATS-14F-29-C1-R0 is a thermal heat sink specifically designed for use in high-standard applications where high power dissipation is required. This particular model is constructed using aluminum alloy, resulting in increased heat capacity and excellent heat transfer due to the thermal conductivity of aluminum. Its design also ensures superior corrosion resistance and protects against oxidation as well as improved reliability. In addition, the design has also been optimized to maximize thermal performance, making it an ideal choice for a wide range of applications.

Applications of ATS-14F-29-C1-R0

The ATS-14F-29-C1-R0 was designed for a variety of high-standard applications including CPU cooling, power supply unit cooling, and heat sink coolers for servers, computers, or other electronic devices. It is also suitable for use in high-performance automotive engines and automotive component cooling. Additionally, it is suitable for use in space applications where thermal management and heat transfer are of the utmost importance.

Its optimised mounting design also allows it to be securely fitted to the surface of any machine, making it ideal for most any thermal application. Additionally, its efficiency as a heat sink is further enhanced by its anodized surface which helps to reduce air friction and promotes even airflow. The ATS-14F-29-C1-R0 also features a "Jet-Cool" cooling fan, which cools the surface while increasing performance.

Working Principle of ATS-14F-29-C1-R0

The ATS-14F-29-C1-R0 operates based on the principle of a thermally conductive metal and its ability to conduct away heat. This heat is then spread to its extended surfaces and eventually dissipated into the air. The alloy of aluminum used in the construction of the ATS-14F-29-C1-R0 ensures superior thermal conductivity which allows for maximum heat transfer from the surface of the device to the external air. This dissipates the heat away from the device and helps to protect it from overheating.

In addition, the “Jet-Cool” fan that is also included further enhances the cooling capabilities of the device by forcing air to flow over the surface of the heat sink. This helps to further dissipate the heat away from the device, thus allowing the device to operate at optimal temperatures. Additionally, the fan design also ensures that dust and other impurities are kept away from the surface, thus ensuring the optimal performance of the device.

Conclusion

The ATS-14F-29-C1-R0 is a high-performance thermal heat sink constructed of aluminum alloy that was designed for a variety of applications. Its optimised design features an anodized surface which helps to reduce air friction and promote even airflow, as well as a “Jet-Cool” fan which further enhances heat dissipation. Its efficient operation relies on the principles of thermally conductive metals and its ability to conduct heat away effectively, ultimately protecting the device from overheating and ensuring its optimal performance.

The specific data is subject to PDF, and the above content is for reference

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