| Allicdata Part #: | ATS-14F-48-C3-R0-ND |
| Manufacturer Part#: |
ATS-14F-48-C3-R0 |
| Price: | $ 3.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14F-48-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.47004 |
| 30 +: | $ 3.27726 |
| 50 +: | $ 3.08448 |
| 100 +: | $ 2.89170 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.50614 |
| 1000 +: | $ 2.45794 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential to ensure the reliable and effective performance of electronic components. Heat sinks, such as the ATS-14F-48-C3-R0, are commonly used to dissipate heat generated by various electronic components. ATS-14F-48-C3-R0 is a very popular heat sink among the professional filed.
Essentially, the ATS-14F-48-C3-R0 is a metal-based, finned heat sink designed to dissipate heat from electronic components, including microprocessors, through the use of air convection. This thermal management product sits on top of a component and uses a mixture of fins, or fins of varying geometries, to extract thermal loads and spread the heat over a broader area. This helps to effectively divert thermal energy away from the component, allowing for greater thermal performance.
The ATS-14F-48-C3-R0 is a universal fit heat sink, so it can be used with any device that requires thermal management. Additionally, this product is extremely versatile, allowing for a variety of applications. It is compatible with a broad range of platforms and can be used to cool electronic components operating in a wide range of temperatures. Furthermore, it is relatively easy to install and maintain, making it an ideal choice for anyone seeking an effective thermal solution.
The ATS-14F-48-C3-R0 features a low-profile design, allowing it to be used for applications where the component’s surface needs to remain unobstructed or there is limited space for a standard heat sink. The product is lightweight, making it easy to handle and transport as needed, and it is cost-effective, delivering an extremely high value for money.
This product is designed to provide an energy efficient thermal solution, ensuring that the heat is quickly and completely removed from the component, thereby reducing power consumption and prolonging the lifespan of the device. The ATS-14F-48-C3-R0 is available in a variety of sizes, ranging from an index of 0 through to an index of 8. This product also features a high-quality metal base that offers a solid foundation for the heat sink.
In conclusion, ATS-14F-48-C3-R0 is an extremely effective heat sink suitable for a wide range of applications. The product features a low profile design, a variety of size options, and a robust metal base construction. It is extremely efficient at dissipating heat and is cost-effective, making it an ideal choice for anyone seeking an effective thermal management solution.
The specific data is subject to PDF, and the above content is for reference