ATS-14F-63-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.32°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal – Heat Sinks are traditionally used in applications such as electronic heat sink cooling, automotive cooling, signal conditioning, and power conversion. ATS-14F-63-C2-R0 provides a new and improved solution for thermal management needs. This heat sink has a large thermal capacity and an efficient thermal-engineering design, allowing for better performance and extended lifetime for industrial electronics. In this article, we will discuss the application field and working principle of ATS-14F-63-C2-R0.The ATS-14F-63-C2-R0 heat sink is designed to dissipate heat away from an attached electronic component. The heat sink consists of two parts: a base plate and several fins. The base plate is constructed of aluminum or copper alloy and provides a strong, stable foundation for the fins. The fins are made of aluminum and are evenly distributed across the plate. The fins are arranged in a staggered pattern to increase surface area, allowing for improved heat transfer.In many cases, ATS-14F-63-C2-R0 heat sinks are used in conjunction with fans to improve heat dissipation. Fans increase air flow across the fins, providing increased surface area for greater heat transfer. In systems where space is limited, a fanless design can be used. This is beneficial when cooling requirements are minimal or when only one heat sink is used for multiple components.To guarantee optimal performance, ATS-14F-63-C2-R0 heat sinks must be securely mounted to the device or component to which it is attached. To ensure the best contact between the heat sink and the component, a high-grade thermal adhesive should be applied. This adhesive ensures that the heat sink will stay securely in place and will not become dislodged due to vibration or dissipating heat.In addition to providing an effective cooling solution, ATS-14F-63-C2-R0 heat sinks also offer corrosion protection. The fins and base plate of this particular heat sink are electroplated with a nickel and tin alloy, creating a layer of protection for the underlying metal. This layer helps prevent rust and corrosion, helping to extend the life of the heat sink.The ATS-14F-63-C2-R0 heat sink is a versatile solution for cooling a variety of electronics and components. Its large thermal capacity, efficient design, and corrosion-resistant coating make it the perfect choice for industrial and commercial applications. By investing in a quality thermal solution, customers can be confident that their electronics will work reliably and efficiently.

The specific data is subject to PDF, and the above content is for reference