| Allicdata Part #: | ATS-14F-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-14F-73-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14F-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a type of heat exchanger that is used to absorb and dissipate heat from electrical components. The ATS-14F-73-C1-R0 is a two-phase thermal-heat sink, designed to efficiently transfer heat away from electronic components while increasing the internal temperature of the component. It is one of the most efficient and reliable solutions for temperature control in the industry.
The ATS-14F-73-C1-R0 is composed of two elements: an aluminum base, which provides the heat-sink surface area, and a high-performance thermally conductive adhesive, which bonds the aluminum base to the component, allowing for optimal heat transfer. This combination of materials gives the ATS-14F-73-C1-R0 a superior thermal capacity compared to other thermal-heat-sinks available in the market. The adhesive is able to increase the internal temperature of the component, while limiting the amount of heat absorbed by other nearby components.
The ATS-14F-73-C1-R0 is suitable for a variety of applications, including industrial and automotive electronics, telecommunications systems, consumer electronic products, and medical device systems. The heat sink is suitable for all types of semiconductor devices, including IGBTs, MOSFETs, and other transistors.
The ATS-14F-73-C1-R0 is designed with two main components: the base and the thermal adhesive. The base is an extruded aluminum frame that has been treated with a thin film of thermally conductive adhesive. The adhesive provides a better thermal interface between the base and the component, and it also helps to increase the internal temperature of the component. The base also contains a number of fins, which increase the surface area in contact with the air, allowing for better heat dissipation. The fins are designed to increase the internal temperature of the component while limiting the amount of heat absorbed by nearby components.
The thermally conductive adhesive used in the ATS-14F-73-C1-R0 is a high-performance polymer that has been formulated to create an efficient heat transfer between the component and the base. The adhesive is designed to maintain a consistent temperature, even with heavy loads, and it also resists electrical shocks and temperature variations. The adhesive also has a low viscosity, meaning that it can be easily applied and can withstand normal handling.
The ATS-14F-73-C1-R0 is a two-phase thermal-heat sink designed for efficient heat dissipation and temperature control. Its combination of materials and components ensures that it is able to perform consistently, and its thermally conductive adhesive makes it ideal for a variety of applications. Its efficiency and reliability make it a go-to solution for heat sink requirements.
The specific data is subject to PDF, and the above content is for reference