| Allicdata Part #: | ATS-14F-75-C3-R0-ND |
| Manufacturer Part#: |
ATS-14F-75-C3-R0 |
| Price: | $ 3.44 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14F-75-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.12669 |
| 30 +: | $ 3.04206 |
| 50 +: | $ 2.87305 |
| 100 +: | $ 2.70409 |
| 250 +: | $ 2.53507 |
| 500 +: | $ 2.45056 |
| 1000 +: | $ 2.19705 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-14F-75-C3-R0: Thermal- Heat Sink Application Field and Working Principle
ATS-14F-75-C3-R0 is a thermal- heat sink that is used to dissipate heat away from electronics components, such as CPUs, chipsets, and other integrated circuits. The heat sink is made up of a heat-conducting metal that is designed to absorb and remove unwanted heat generated from these components. The heat conducts it to its surface and transfers it to the surrounding air or heat absorption materials.
The ATS-14F-75-C3-R0 heat sink has many applications in various industries. In consumer electronics, it can be used to cool CPUs, chipsets, and other integrated circuits, providing stable and reliable performance and increased component life. In the aerospace industry, it can be used to cool electronic components for high-altitude applications. In the medical field, it can be used to dissipate heat from medical devices and equipment to prevent overheating.
The ATS-14F-75-C3-R0 heat sink is made of a combination of extruded aluminum and copper. Copper is a superior conductor of heat, while aluminum is an excellent thermal conductor. These two metals combined provide superior heatsink performance. The ATS-14F-75-C3-R0 also has high-density metal fins that are designed to maximize heat transfer. The fins create more surface area and allow the heat to dissipate quickly and effectively.
The ATS-14F-75-C3-R0 heat sink works by dissipating the heat away from the components it cools. It does this by absorbing the heat and transferring it away from the components at a faster rate than they can generate it. The fins on the heat sink then disperse the heat into the surrounding air or absorb it using a heat absorption material. This process keeps the components cooler and prevents them from overheating.
For the best performance, the ATS-14F-75-C3-R0 heat sink should be installed correctly. It should be placed in an area where there is good air flow to allow for optimal heat transfer and dissipation. The heat sink should also be mounted on either a motherboard or an off-board mounting system for better stability.
The ATS-14F-75-C3-R0 is an efficient and effective thermal- heat sink that has an extensive range of applications in various industries. It is made of a combination of copper and aluminum and has high-density fins that allow for maximum heat dissipation. For optimal performance, it should be installed correctly and have good air flow for heat transfer. This thermal-heat sink can provide stability and reliability for components while providing a longer usable life.
The specific data is subject to PDF, and the above content is for reference