ATS-14G-142-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.07°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

ATS-14G-142-C2-R0 is an advanced thermal solution created specifically for the purpose of high performance electronics cooling applications. It is classified as a thermal-heat sink, and it is designed to provide a highly efficient heat dissipation system which ensures a low system temperature. This product is available in a variety of shapes, sizes and configurations, making it suitable for a wide range of applications.

Application Field

ATS-14G-142-C2-R0 is used in a variety of applications, including power supplies, medical equipment, communications routers, military applications, and gaming consoles. This product is highly suited for applications requiring high performance and low system temperature. The enhanced structural design ensures excellent heat transfer between the element and its environment, allowing for a long life span and higher reliability. Additionally, the advanced technology used in its construction allows for excellent performance while maintaining minimal power consumption.

Working Principle

ATS-14G-142-C2-R0 utilizes a combination of conduction and convection to transfer heat away from the electronics system and reduce the overall system temperature. This product has a high thermal conductivity level which enables it to efficiently dissipate heat from the system. The device includes a number of heat spreaders and fans which direct airflow around the system. The thermal transfer is further enhanced by the presence of a finned structure along each side of the sink, which increases the surface area for heat transfer. Once the heat is dissipated, the system temperature is kept at a constant level, which helps to maintain a stable, efficient system.

Conclusion

ATS-14G-142-C2-R0 is an advanced thermal solution which is designed for high performance electronic cooling applications. It is classified as a thermal-heat sink, and it utilizes a combination of conduction and convection to transfer heat away from the electronics system in order to reduce the system temperature. This product is available in a variety of shapes, sizes and configurations, making it suitable for a wide range of applications, and its advanced thermal transfer technology ensures excellent performance while remaining highly efficient.

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