| Allicdata Part #: | ATS-14G-178-C3-R0-ND |
| Manufacturer Part#: |
ATS-14G-178-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14G-178-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-14G-178-C3-R0 is a type of thermal - heat sinks that can be used for a variety of applications. It is a small heat sink designed for medium to higher power devices with a maximum controlled dissipation of up to 10 watts. It has an advantage in providing high speed and efficiency due to its high heat dissipation capability.
The ATS-14G-178-C3-R0 comes with a cast aluminum thin heat pipe with a polyamide-imide insulation material that is used for cooling. This material helps to ensure that heat is transferred efficiently and quickly away from the device that is being cooled. The main feature of this heat sink is that it is suitable for a wide variety of applications, including in the electronics industry, industrial lighting, medical equipment and automotive applications.
The ATS-14G-178-C3-R0 heat sink uses fans and thermoforming technology to ensure that the heat is properly dissipated. The fans, or louvers, are placed at the back of the heat sink in order to push the air away from the device and force it to dissipate through the fins of the heat sink. They are also used to move heat away from areas where it is not needed, such as the edges of the board. The thermoforming technology is used to ensure that the heat from the device is evenly distributed across the parts of the heat sink.
The ATS-14G-178-C3-R0 has a maximum operating temperature of up to 60°C, making it suitable for use in industrial applications. The thermal resistance of this type of heat sink is typically around 0.14 °C/W, which means that it can achieve optimal cooling performance in most applications.
Another unique feature of the ATS-14G-178-C3-R0 is its connector technology. This technology is used to provide a better electrical connection between the device and the heat sink, which helps to ensure that there are no heat losses. The connector technology also helps to reduce the size of the heat sink, making it more compact and easier to install.
Overall, the ATS-14G-178-C3-R0 is a great choice for a number of applications. Its efficient design makes it ideal for medium to higher power applications, while its efficient heat transfer and cooling capabilities ensure that the device remains cool. Its connector technology also ensures that there are no heat losses, while the thermoforming technology ensures that the heat from the device is evenly spread across the surface of the heat sink. This makes it suitable for use in a variety of applications, such as industrial lighting, medical equipment and automotive applications.
The specific data is subject to PDF, and the above content is for reference