| Allicdata Part #: | ATS-14G-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-14G-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14G-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are used in numerous applications to dissipate heat away from components and minimize the likelihood of those components overheating from the excess heat. The ATS-14G-20-C3-R0 is a popular and versatile heat sink that allows for a wide variety of uses. Understanding its structure, application field, and working principle will give users a better understanding of how to use it and how it helps them in their thermal management applications.
Structure
The ATS-14G-20-C3-R0 is a heat sink made of high-performance copper and aluminum that consists of an aluminum base and a copper heat spreader. Together, these two pieces form a fin tower with a 20mm fin spacing. The copper threads are plated with nickel, giving it an effective corrosion prevention layer and a shiny surface. All the components are securely fastened together with a set of four mounting screws.
Application Field
The ATS-14G-20-C3-R0 is ideal for applications that require a fairly compact heat sink. It can handle up to a maximum operating temperature of 80°C and thermal resistance of 0.6°C/W. This makes it well-suited for a variety of applications including: industrial control systems, computer servers, automotive electronics, and LED lamps.
Working Principle
The ATS-14G-20-C3-R0 is a two-stage cooling solution. In the first stage, the heat generated by the component is transferred to the heat dissipation unit and the heat spreader. The heat spreader then dissipates the heat along the fin tower, which increases the surface area to aid in cooling. The fin tower is strictly designed to maximize the amount of heat dissipated in this first stage. In the second stage of cooling, the ambient temperature beside the device dissipates the heat away from the component through a combination of air convection and radiation.
Conclusion
The ATS-14G-20-C3-R0 is a high-performance thermal management solution that is well suited to environments where a compact heat sink is needed. Its two-stage cooling system combined with high-performance materials helps maximize the amount of heat dissipated away from the component. It can handle up to a maximum operating temperature of 80°C and thermal resistance of 0.6°C/W, making it well-suited for a variety of applications and environments.
The specific data is subject to PDF, and the above content is for reference