| Allicdata Part #: | ATS-14G-200-C3-R0-ND |
| Manufacturer Part#: |
ATS-14G-200-C3-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14G-200-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45933 |
| 30 +: | $ 3.36588 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-14G-200-C3-R0 is a type of thermal-heat sink. It functions by dissipating heat from either electrical or electronic components. Heat sinks are typically utilized in high powered electronics such as laser diode systems, high-power AC/DC motors, and microwave ovens. The thermal-heat sink is effective because it takes heat away from the component it is connected to, and distributes it over a larger surface area, allowing it to dissipate quicker and with more efficiency. The ATS-14G-200-C3-R0 thermal-heat sink provides protections for sensitive, affected components.
What makes a thermal-heat sink like the ATS-14G-200-C3-R0 a standout is that it is designed for placement directly above or below a component, thereby effectively removing heat from the source with no air-flow interference. The base of the ATS-14G-200-C3-R0 is constructed of aluminum as are its fin-stacks, and it is outfitted with a dense pattern of cooling microreplicates which is required for low-airflow applications. Fin spacing is 0.4mm for maximum heat dissipation, and its fin-stacks are structured so as to direct the air in a direct path.
The ATS-14G-200-C3-R0 thermal-heat sink is designed to effectively remove heat from components quickly and efficiently. The fin-stacks and cooling microreplicates are carefully calibrated to dissipate heat from the component with no air-flow interference, and the material used to construct the heat sink is aluminum E-226, which is renowned for its excellent heat conductivity. In addition, the design of the ATS-14G-200-C3-R0 also allows it to be mounted to traditional mounting plates with ease, and its fin-stacks are structured to direct the air in a direct path for maximum cooling.
The ATS-14G-200-C3-R0 thermal-heat sink is ideal for use on any mechanical or electronic system, due to its ability to dissipate heat quickly and effectively. It is useful for components that generate a considerable amount of heat such as laser diodes, high-power AC/DC motors, and microwave ovens. The aluminum construction, fin spacing, and cooling microreplicates make this thermal-heat sink an ideal choice for applications where air-flow is limited or inadequate. The ATS-14G-200-C3-R0 thermal-heat sink is also especially well-suited for applications where space is at a premium.
In addition to its excellent heat dissipation abilities, the ATS-14G-200-C3-R0 also offers superior flexibility and ease of installation. It can be mounted to all standard mounting plates with no modification, and its simple design allows for quick and easy installation. This makes the ATS-14G-200-C3-R0 an ideal choice for applications that require quick assembly or frequent relocation. Its low profile and lightweight design also make it an excellent choice for systems where space is at a premium.
The ATS-14G-200-C3-R0 thermal-heat sink is a premier example of efficient and effective heat dissipation. Its aluminum construction, fin-stacks, and cooling microreplicates direct air in a direct path, allowing the heat sink to quickly and effectively dissipate heat. Its low profile and lightweight design allow for easy installation and make it a great choice for applications that require quick assembly or frequent relocation. The ATS-14G-200-C3-R0 is an ideal choice for anyone looking for supreme heat dissipation capabilities in a reliable and easy to install product.
The specific data is subject to PDF, and the above content is for reference