| Allicdata Part #: | ATS-14G-32-C1-R0-ND |
| Manufacturer Part#: |
ATS-14G-32-C1-R0 |
| Price: | $ 5.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14G-32-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.71933 |
| 30 +: | $ 4.45704 |
| 50 +: | $ 4.19492 |
| 100 +: | $ 3.93271 |
| 250 +: | $ 3.67053 |
| 500 +: | $ 3.40835 |
| 1000 +: | $ 3.34281 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The thermal - heat sinks ATS-14G-32-C1-R0 are used to control the maximum temperature of electrical and electronic components. The process is done by dissipating the heat from the components into the surrounding environment. The ATS-14G-32-C1-R0 is specifically designed to do this job efficiently and effectively.
The most significant feature of the ATS-14G-32-C1-R0 is its ability to dissipate heat quickly and evenly throughout the application field. This ensures that the components operate within their temperature limits and, hence, perform optimally. To achieve this, the heat sinks utilize highly conductive materials, such as copper, aluminum, and brass, as well as efficient air flow management. The structure of the heat sinks also promote cooling performance, with large surface area fins for efficient heat dissipation and minimal air turbulence.
The ATS-14G-32-C1-R0 is also designed to be easily mounted on the electronics. The heat sinks come with pre-configured mounting holes to make installation quickly and easily. Depending on the application, the heat sinks can also be surface-mounted on the circuit board.
The major components of the ATS-14G-32-C1-R0 are the heat sink, heatsink fins, fan, mounting hardware, and thermal pad. The heat sink absorbs and dissipates heat from the components, while the heatsink fins aid in spreading the heat throughout the application area. The fan provides the airflow needed to transfer the heat away from the components. The thermal pad is used in between the components and the heat sink to ensure efficient heat transfer between the two surfaces.
The working principle of the ATS-14G-32-C1-R0 is quite straightforward. When a component is powered on, it generates heat which is then dissipated into the surrounding environment through the heat sink. The fan or blower then draws the hot air away from the electronics, ensuring that the components stay within their operational temperature range. This prevents the electronics from becoming damaged due to excessive heat.
In summary, the ATS-14G-32-C1-R0 is an effective way of controlling the maximum temperature of electrical and electronic components. It utilizes highly conductive materials and efficient air flow management principles to dissipate heat quickly and evenly. The pre-configured mounting hardware makes installation easy and the fan provides the necessary air flow to keep the components cool. The thermal pad is also useful in ensuring efficient heat transfer between the components and the heat sink.
The specific data is subject to PDF, and the above content is for reference