| Allicdata Part #: | ATS-14G-55-C3-R0-ND |
| Manufacturer Part#: |
ATS-14G-55-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14G-55-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 24.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are used in a variety of applications that involve the transfer of heat. The ATS-14G-55-C3-R0 utilizes advanced thermals to help dissipate heat away from electronic components, helping to maintain the proper operating temperature and increase the lifespan of the device. In this article, we will review the application field and working principles of the ATS-14G-55-C3-R0.
The ATS-14G-55-C3-R0 is designed to provide cooling for electronic components in a variety of applications. It is a ultra-compact thermal heatsink with a thermally-efficient fanless design. It features a gold-plated PCB substrate for better heat conduction, a low thermal resistance of 0.155°C/W, and an integrated thermal compound for efficient heat absorption. It is also capable of dissipating up to 39.75 watts of heat.
The ATS-14G- 55-C3-R0 can be used in a variety of applications. It is suitable for mounting on flat surface or via wire mesh systems. It is also compatible with a variety of power modules, LED drivers, and micro-electronic components. Its fanless design makes it ideal for applications that require low-noise cooling.
The working principle of the ATS-14G-55-C3-R0 is thermal engineering. Thermal engineering involves the principles of heat transfer, thermodynamics, and fluid mechanics to design components and systems that transfer or dissipate heat. In the case of the ATS-14G-55-C3-R0, the heat transfer is facilitated through the gold-plated PCB substrate, allowing for efficient heat conduction. The integrated thermal compound helps absorb and dissipate the heat away from the device to ensure proper operating temperatures.
In conclusion, the ATS-14G-55-C3-R0 is an ultra-compact thermal heatsink designed to provide cooling for electronic components in a variety of applications. It features a gold-plated PCB substrate, a low thermal resistance of 0.155°C/W, and an integrated thermal compound for efficient heat absorption. It is also capable of dissipating up to 39.75 watts of heat, making it suitable for power modules, LED drivers, and micro-electronic components. The working principle of the ATS-14G-55-C3-R0 is thermal engineering, which makes use of heat transfer and thermodynamics to efficiently transfer or dissipate heat away from the device.
The specific data is subject to PDF, and the above content is for reference