| Allicdata Part #: | ATS-14G-75-C3-R0-ND |
| Manufacturer Part#: |
ATS-14G-75-C3-R0 |
| Price: | $ 3.44 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14G-75-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.12669 |
| 30 +: | $ 3.04206 |
| 50 +: | $ 2.87305 |
| 100 +: | $ 2.70409 |
| 250 +: | $ 2.53507 |
| 500 +: | $ 2.45056 |
| 1000 +: | $ 2.19705 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks
Heat sinks are designed to dissipate heat from a component in order to maintain a lower temperature in the component and its immediate environment. Heat is dissipated through a number of different methods, including chimney-type natural convection, forced convection, and thermal energy radiation.
ATS-14G-75-C3-R0 Application Field and Working Principle
The ATS-14G-75-C3-R0 Heat Sink from JOUR, Inc. is a 75mm x 75mm x 15mm aluminum thermal heat sink designed for optimal heat dissipation. It is capable of dissipating up to 40 watts of power at an ambient temperature of +29°C. It operates on the principle of thermal energy radiation, which involves the transfer of thermal energy through the emission of infrared radiation.
The ATS-14G-75-C3-R0 Heat Sink is designed for applications requiring high heat dissipation in small form factors. Its small size and low profile make it ideal for applications where space is limited, such as handheld devices, embedded boards, industrial controllers, and computers.
The ATS-14G-75-C3-R0 Heat Sink features a single-piece, die-cast aluminum construction with a black anodized finish. The base measures 75mm x 75mm, and the staked pins measure 4.5mm high. The heat sink is specifically designed to provide optimal heat dissipation under environmental conditions with little or no air movement. The die-cast aluminum construction provides superior heat conductivity and allows for a thin profile, allowing more components to be packed into a tight space.
The design utilizes two channels for convection enhancement. The first channel directs air away from the source of heat and towards the cooling fins. This causes a decrease in air pressure around the heat source, accelerating the rate at which air is drawn in, increasing convection and cooling efficiency. The second channel is designed to allow air to escape from the heat sink, thus lowering the pressure gradient and allowing for optimized airflow.
The ATS-14G-75-C3-R0 Heat Sink is capable of providing superior thermal dissipation in applications where space is restricted and cooling air movement is minimal. Its design and construction ensure maximum conductivity and convection efficiency, providing an optimal balance between heat dissipation and form factor.
The specific data is subject to PDF, and the above content is for reference