ATS-14G-90-C1-R0

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Thermal management is a key component in successful operation of electronic equipment. Dissipating heat away from sensitive components is the primary goal of thermal management. Two commonly used techniques are dropping the operating temperature through increased air flow and transferring heat away from the component to a specified device or structure. Heat sinks are a passive thermal management option utilizing metal materials to efficiently conduct heat away from a mounted component. The ATS-14G-90-C1-R0 is a specific model of heat sink with a wide range of applications and uses.

Product Description
The ATS-14G-90-C1-R0 heat sink is made from an aluminum alloy material with a thin fin style mount system. It has a profile of 14mm x 90mm x 20mm. The heat sink uses 4 M3 tapped holes on each of the 90mm sides for attachment to a users preferred chassis or thermal interface material. It is designed to be used as a standard heat sink with an Intel LGA-115x, AMD FM-2, or AMD AM-4 processors. To provide even more cooling surface area, the center portion of the base is cut out. This provides additional structural support and removal of air pockets that inhibit cooling.

Application Fields
This particular heat sink is well suited for a wide range of applications. The thermal interface material is suited for Intel LGA-115x, AMD FM-2, and AMD AM-4 socket types. The relatively small footprint and thin design make it a good choice for applications that needs a small heat exchange component. Some examples of applications where the ATS-14G-90-C1-R0 could be used include small form factor gaming computers, mini-ITX or mobile cases, and HTPCs that need to be built into walls or shelves. The aluminum alloys heat dissipation capabilities make the device applicable for high-end gaming platforms, and environments that require reliable and optimized thermal management.

Working Principle
The ATS-14G-90-C1-R0 utilizes a standard vapour chamber and fin heat sink design. Vapour chambers are copper construction plates, about 0.3mm thick and can typically be bent to achieve positions needed for optimal heat dissipation. The thin fin design of the ATS-14G-90-C1-R0 creates high performance air flow for thermal dissipation. These fins consist of a profile that allows for increased surface area as well as air channels for optimum airflow for maximum heat flow from the base allowing heat to be absorbed quickly and released into the ambient air.

Conclusion
The ATS-14G-90-C1-R0 is a product specifically designed for thermal management applications. It serves as a reliable and efficient heat sink, capable of meeting the requirements of various types of equipment. Its usage stretches from small form factor desktop cases to special-purpose systems such as gaming platforms and chassis inside walls. With its aluminum alloy construction, tin fin design, and vapour chamber heat sink, the ATS-14G-90-C1-R0 is an excellent choice for any application where thermal management is needed.

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