| Allicdata Part #: | ATS-14G-98-C3-R0-ND |
| Manufacturer Part#: |
ATS-14G-98-C3-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14G-98-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.79386 |
| 30 +: | $ 3.58323 |
| 50 +: | $ 3.37239 |
| 100 +: | $ 3.16159 |
| 250 +: | $ 2.95082 |
| 500 +: | $ 2.74005 |
| 1000 +: | $ 2.68736 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.39°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management with heat sinks is of critical importance to maintain the stability and performance of sensitive and critical electronic equipment. The ATS-14G-98-C3-R0 heat sink is a specific, highly effective type of thermal management product designed to protect and regulate the temperature of electronic components in a wide range of applications. In this article, we will explain the ATS-14G-98-C3-R0 application field and working principle of this unique heat sink.
ATS-14G-98-C3-R0 Heat Sink Design
The ATS-14G-98-C3-R0 heat sink is a uniquely designed component which works by passively transferring heat from one source to another, helping to keep electronic components from overheating. This heat sink is fabricated from high-grade aluminum, making it lightweight yet strong and durable. ATS-14G-98-C3-R0 offers both anodized and powder coatings for a professional presentation. It also has an attractive and modern appearance, making it ideal for use in industrial, commercial, and home applications.
ATS-14G-98-C3-R0 Application Field
The ATS-14G-98-C3-R0 heat sink is specifically designed for use in various applications, including computers, control systems, telecommunications, and networking applications. It is an excellent choice for a wide range of electronic components, such as CPUs, GPUs, memory modules, and power modules. The ATS-14G-98-C3-R0 heat sink is also ideal for cooling miniature electronic components and devices, such as flash memory, wireless modules, and small modules.
Working Principle of ATS-14G-98-C3-R0 Heat Sink
The ATS-14G-98-C3-R0 heat sink works through a process called "thermal conduction". Heat is transferred from the source (the hot electronic component) to the heat sink via thermal conduction. As the heat is transferred through the heat sink, it is dissipated, resulting in a decrease in temperature of the electronic component. This helps prevent the component from overheating and failing experienced by many components when their temperature reaches critical levels.
The heat sink contains multiple specialized fins in order to increase its surface area. This helps to maximize the rate at which heat is transferred from the source to the heat sink, and ultimately helps to cool the electronic device more effectively. To further maximize the cooling efficiency, the ATS-14G-98-C3-R0 heat sink also comes with a built-in fan, which helps to direct the heat away from the source.
Conclusion
The ATS-14G-98-C3-R0 heat sink is an effective way to protect electronic components from overheating and premature failure. It is specifically designed for use in various applications, including computers, control systems, telecommunications, and networking applications. Additionally, its lightweight yet strong aluminum construction allows easy installation and ensures superior stability as well as a professional presentation. Its unique design and the use of thermal conduction makes it an effective way to regulate temperature in sensitive and critical electronic equipment.
The specific data is subject to PDF, and the above content is for reference