| Allicdata Part #: | ATS-14H-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-14H-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14H-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential components in the electronic circuit design process since they are responsible for efficiently dissipating the heat generated by electrical components. ATS-14H-10-C3-R0 is an advanced thermal heat sink solution which is widely used in a variety of fields and applications, ranging from industrial engineering to auto racing.
This heat sink combines the superior thermal design of a pin fin and base plate with a patented "flow-through alloy pin" design. This unique combination allows the heat sink to achieve 200 to 400 percent greater thermal performance than traditional air heat sinks. The ATS-14H-10-C3-R0 also offers a high level of efficiency and reliability in applications that require an extremely low profile and compact design.
In terms of application fields, the ATS-14H-10-C3-R0 provides high-performance thermal management solutions for many sectors. Firstly, this heat sink is widely used in industrial engineering, such as cooling electrical components in a robotic arm or 3D printer. Secondly, this heat sink is also often used for cooling the components of high-performance race cars and motorcycles. Thirdly, the ATS-14H-10-C3-R0 is also employed for the thermal management of smartphones, laptop computers, servers/network components, LED panels, and more.
At the heart of the ATS-14H-10-C3-R0’s success is its patented “flow-through alloy pin” design. This advanced pin design features an intricate network of alloy pins, in addition to a low thermal resistance "flow-enhancing" base plate. The alloy pins and base plate are designed to create a highly efficient forced-air flow pattern which increases the thermal performance of the heat sink. In addition, the alloy pins are designed to act like “heat pipes”, actively wicking away heat from the expanse of heat sources.
The operation of the ATS-14H-10-C3-R0 is easy to understand. It begins with the alloy pins wicking away the heat generated by the electrical components. At the same time, the base plate enhances the heat dissipation by evenly distributing the heat over the alloy pins. Finally, once the heat has been dissipated, a forced-air system is activated, further removing the heat away from the heat sources and into the ambient environment.
Overall, the ATS-14H-10-C3-R0 is a robust, high-performance thermal management solution which is suitable for a wide variety of applications. It combines a superior thermal design with a patented "flow-through alloy pin" design, resulting in a 200 to 400 percent increase in thermal performance. In addition, this heat sink is also lightweight, offers a low profile, and requires minimal installation effort.
The specific data is subject to PDF, and the above content is for reference