| Allicdata Part #: | ATS24639-ND |
| Manufacturer Part#: |
ATS-14H-11-C2-R0 |
| Price: | $ 4.06 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14H-11-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.68550 |
| 10 +: | $ 3.58596 |
| 25 +: | $ 3.38663 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-14H-11-C2-R0 is a thermal management solution for a variety of applications. It is a heat sink designed to dissipate thermal energy generated from various electronic and mechanical components, protecting them from the risk of overheating or short circuiting. The ATS-14H-11-C2-R0heat sink is designed to remove and dissipate unwanted heat from the component, allowing for its safe operation in higher temperatures. The design includes a thermally efficient top fin array and a base plate with thermally conductive material. This combination ensures high heat dissipation, regardless of the operating environment.
The ATS-14H-11-C2-R0 establishes a balance in thermal management between cooling the components and controlling airflow. This balance promotes efficient use of energy through improved heat removal. The thermal mass of the ATS-14H-11-C2-R0 also allows for an efficient transfer of large amounts of heat, making the heat sink suitable for higher powered components that require large amounts of thermal energy to be dissipated.
The heat sink is designed to operate between 0 and 80 degrees Celsius, making it suitable for a wide range of applications. The ATS-14H-11-C2-R0 can be used in a wide variety of electronics, from computers and microcontrollers to telecommunications and industrial equipment. It is also suitable for a variety of power sources, including AC, DC, and solar.
The ATS-14H-11-C2-R0 also uses a patented technology that reduces thermal resistance between the component and the heat sink. This technology helps to improve thermal performance between component and the sink, resulting in better overall heat dissipation. The technology also enables the heat sink to be mounted in a variety of orientations, allowing for efficient use in different applications.
The ATS-14H-11-C2-R0 is also lightweight and easy to install. The heat sink is designed to mount directly onto the components, ensuring a secure fit and reliable performance. The ATS-14H-11-C2-R0 can also be mounted into existing equipment or integrated into custom solutions. This makes the ATS-14H-11-C2-R0 a versatile and cost-effective thermal management solution.
The ATS-14H-11-C2-R0 is a reliable and efficient thermal management solution. Its thermally efficient fin array and patented technology provide superior performance in dissipating heat from components in a variety of applications. Its lightweight construction and easy installation make the ATS-14H-11-C2-R0 a cost-effective and efficient thermal management solution.
The specific data is subject to PDF, and the above content is for reference