ATS-14H-114-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-14H-114-C3-R0-ND

Manufacturer Part#:

ATS-14H-114-C3-R0

Price: $ 3.47
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X15MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-14H-114-C3-R0 datasheetATS-14H-114-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.15063
30 +: $ 3.06516
50 +: $ 2.89498
100 +: $ 2.72462
250 +: $ 2.55435
500 +: $ 2.46919
1000 +: $ 2.21376
Stock 1000Can Ship Immediately
$ 3.47
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.53°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is important in many industrial applications, especially in those that depend on efficient thermal control systems to remain running. The ATS 14H 114-C3-R0 is a bottom fed, passive heat sink design with increased surface area, allowing increased cooling performance when used in various environments. The low profile design allows it to fit comfortably into tight spaces, and its highly reflective, nickel-plated aluminum pin fins allow for improved heat dissipation.

The ATS-14H-114-C3-R0 is primarily used with electronics and components that produce a high amount of heat, in order to reduce the thermal threat a component faces when operating in an environment with tight thermal requirements. It is designed to be extremely efficient with a low profile, allowing it to fit in most tight spots with ease.

The ATS-14H-114-C3-R0 has a maximum cost-efficiency ratio for reaching maximum heat dissipation. This is achieved by having an extremely high surface area to volume ratio, minimizing thermal resistance and increasing surface area for efficient heat transfer. The heat transfer is further facilitated by the fin geometry which encourages laminar flow and increased turbulence. The aluminum construction also benefits from the natural heat transfer properties of aluminum, allowing more heat to be absorbed and distributed faster.

The working principle of the ATS-14H-114-C3-R0 is based on the use of a bottom fed, passive heat sink design. This design allows air to be drawn through the fins of the heat sink, cooling the device by releasing the heat into the environment. The heat sink is designed with fin structures that are designed to encourage laminar airflow with increased turbulence. This allows more air to be drawn through the heat sink and increases the cooling effect. The materials used in the design also benefit from natural heat transfer properties that aid in the efficient transfer of heat.

A good thermal management system is important for industrial applications that require efficient thermal control. The ATS-14H-114-C3-R0 is an ideal solution for such an application, due to its low profile design, high surface area, and excellent heat transfer properties. Its specialized fin design ensures efficient heat transfer and is perfect for use in tight spaces with limited thermal requirements. Its low cost-efficiency ratio further contributes to its effectiveness, making it a cost-effective thermal management solution. The working principle of this heat sink design is based on bottom fed, passive heat dissipation principles and is incredibly efficient thanks to its increased surface area and fin geometry.

The specific data is subject to PDF, and the above content is for reference

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