| Allicdata Part #: | ATS-14H-116-C3-R0-ND |
| Manufacturer Part#: |
ATS-14H-116-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14H-116-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is essential to ensure reliable operation of electronic components and systems. Heat sinks use phase change materials, such as aluminum or copper, to dissipate unwanted heat away from sensitive components. ATS-14H-116-C3-R0 is a thermal heat sink specifically designed to address thermal management requirements in a wide range of industrial applications. This article discusses the application field and working principle of ATS-14H-116-C3-R0.
Application Field
ATS-14H-116-C3-R0 is designed to meet a variety of cooling requirements across multiple industrial applications. It is constructed with a unique combination of advanced materials, including an aluminum substrate and interlocking fins, to provide superior thermal performance. The thermal heat sink is suitable for a variety of cooling applications, including but not limited to, commercial electronics, military electronics, medical and automotive applications. In addition to exceptional cooling performance, ATS-14H-116-C3-R0 offers flexibility in size and style with custom configurations available.
Working Principle
Thermal heat sinks basically work by absorbing the undesired heat from hot components and transferring it to the surrounding cool air. The two main components of ATS-14H-116-C3-R0 are a metal base plate and a set of interlocking fins. The base plate is designed to be thermally conductive, allowing heat to be quickly and efficiently absorbed from the components. The fins are constructed with an aluminum-based material that is highly effective at dissipating heat away from the base plate. The interlocking fins increase the overall surface area, allowing the heat to be spread out and dissipated more effectively.
Heat sinks are typically mounted directly onto hot components, such as processors or other sensitive components. The contact area of ATS-14H-116-C3-R0 prevents heat escaping from the hot components, making sure that the heat is effectively transferred to the thermal heat sink. The combination of strong thermal conductivity and efficient fins ensures that the maximum heat can be dissipated from the device. The greater surface area of the device minimizes the hot spots and allows cooling to be spread out evenly.
Conclusion
ATS-14H-116-C3-R0 is a thermal heat sink designed for a wide range of industrial applications. It is constructed with an aluminum substrate and interlocking fins to provide superior thermal performance. The thermal heat sink works by absorbing the heat from hot components and transferring it to the surrounding cool air. Its strong thermal conductivity and efficient fins maximize heat dissipation and minimize hot spots. The flexibility of size and style makes it an ideal choice for cooling applications.
The specific data is subject to PDF, and the above content is for reference