ATS-14H-130-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-14H-130-C1-R0-ND

Manufacturer Part#:

ATS-14H-130-C1-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X15MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-14H-130-C1-R0 datasheetATS-14H-130-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.56265
30 +: $ 3.36462
50 +: $ 3.16676
100 +: $ 2.96881
250 +: $ 2.77089
500 +: $ 2.57297
1000 +: $ 2.52349
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are essential thermal management components that transfer heat away from heat-generating devices such as processors, power electronics, and lasers. Utilizing various materials, shapes, and construction techniques, these components can effectively dissipate heat from their devices either passively or actively. The ATS-14H-130-C1-R0 is a customized thermal heat sink specifically designed for a variety of applications.

The ATS-14H-130-C1-R0 heat sink is primarily composed of aluminum. The sink has a slightly convex body and is approximately 130mm long, with a height of about 28mm and a width of 128mm. It features 24 fins, each measuring about 2.56mm in height, with the fins spaced at 3.60mm intervals. Connecting the fins are three ridges set at angles of 20, 40, and 60 degrees, which enable the heat sink’s optimized dissipation capabilities.

The ATS-14H-130-C1-R0 also features a variety of mounting holes. The mounting holes include four standard M4 holes located on the sink’s bottom for mounting, as well as specialized screw holes located on the front and top of the sink. Additionally, the heat sink also includes two thermocouples that are integrated into the bottom surface of the heat sink. These thermocouples are able to measure the temperature of the surface of the heat sink, allowing for active temperature monitoring and responsive cooling.

The ATS-14H-130-C1-R0 is designed for use in a variety of applications. Its aluminum body construction provides excellent thermal conductivity capabilities, allowing it to effectively dissipate heat away from its device. Utilizing the integrated thermocouples and specialized mounting holes, the heat sink is extremely easy to install and configure. It is also suitable for use in applications requiring tight spaces, such as small electronics or consumer appliances.

The ATS-14H-130-C1-R0 effectively works by using its aluminum construction and fin structure to dissipate thermal energy away from the device. Through the fins, the sink is able to increase its surface area which is especially beneficial in tight spaces with limited surface space. As the heat from the device is transferred to the heat sink, it is then transferred away from the surface by convection or forced-air cooling mechanisms. This process ensures that the device is kept at a safe operating temperature, even in high-temperature applications.

In conclusion, the ATS-14H-130-C1-R0 is a specialized heat sink specifically designed for a variety of applications. Constructed from aluminum with an optimized fin structure, the sink provides exceptional thermal performance, allowing it to effectively dissipate heat away from its device. It is also simple to install and configure due to its versatile mounting holes and integrated thermocouples. Therefore, the ATS-14H-130-C1-R0 is an ideal solution for dissipating thermal energy away from electronic components and consumer appliances.

The specific data is subject to PDF, and the above content is for reference

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