
Allicdata Part #: | ATS24672-ND |
Manufacturer Part#: |
ATS-14H-14-C2-R0 |
Price: | $ 4.35 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 50X50X20MM XCUT T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 3.95640 |
10 +: | $ 3.85182 |
25 +: | $ 3.63787 |
50 +: | $ 3.42380 |
100 +: | $ 3.20979 |
250 +: | $ 2.99580 |
500 +: | $ 2.78181 |
1000 +: | $ 2.72832 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.969" (50.00mm) |
Width: | 1.969" (50.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.790" (20.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 9.97°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal heat sinks are important components in electronic devices that are used to dissipate heat generated by the device to maintain optimal temperatures. The ATS-14H-14-C2-R0 is a heat sink specifically designed for use with high-end devices, such as servers and industrial machinery. This heat sink is designed to meet the highest standards for heat dissipation, ensuring that the device it is protecting will not experience thermal issues. In this article, we will discuss the application field and working principle of the ATS-14H-14-C2-R0 heat sink.
The ATS-14H-14-C2-R0 heat sink is designed to provide effective cooling of high-load operations in server and industrial applications. This heat sink is made of aluminum alloy, which makes it lightweight and highly effective in heat transfer. It has a large surface area of 84 cm2, which allows for efficient heat transfer away from the device, ensuring optimal performance. Additionally, the heat sink is equipped with a fan that can be used to generate additional airflow to further aid in heat dissipation. With its high-level design, the ATS-14H-14-C2-R0 is able to handle highly demanding loads in server applications.
The working principle of the ATS-14H-14-C2-R0 is relatively simple. When the device it is used with generates heat, the heat is transferred through the heat sink to the surrounding air. The large surface area of the heat sink ensures that the amount of heat transferred is maximized, and the fan generates additional airflow that helps to sweep away any stagnant air, allowing for more efficient heat dissipation. The thermal compound included with the ATS-14H-14-C2-R0 helps to promote better thermal conductivity, ensuring the heat is efficiently transferred from the device to the heat sink.
In conclusion, the ATS-14H-14-C2-R0 is designed to effectively dissipate heat in high-load server and industrial applications. It is constructed from lightweight aluminum alloy, has a large surface area, and is equipped with a fan for additional cooling. The working principle of the heat sink is relatively simple, as it relies on thermal transfer from the device to the heat sink, and airflow generated by the fan to help dissipate the heat. With its high-level design and features, the ATS-14H-14-C2-R0 is an excellent choice for those looking for an efficient and reliable thermal solution.
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