| Allicdata Part #: | ATS-14H-142-C3-R0-ND |
| Manufacturer Part#: |
ATS-14H-142-C3-R0 |
| Price: | $ 3.70 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14H-142-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.32892 |
| 30 +: | $ 3.23862 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are essential elements in both mechanical and electronic applications. The thermal transfer properties of heatsinks play an important role in the life and performance of many products, from automotive and medical to computers and consumer electronics. The ATS-14H-142-C3-R0 is a thermal heat sink designed for high efficiency heat transfer and long life applications.
The heat sink is made from low profile aluminum, and features fully-enclosed mounting holes for added strength and rigidity. The ATS-14H-142-C3-R0 is designed to provide high performance heat transfer. Its fins are designed to maximize air flow and heat dissipation. The fins also provide an effective surface area to allow for the highest levels of heat transfer. The aluminum is anodized to protect the surface from corrosion and dust. The fins are made from durable material to ensure that they last for a long time and that the heat sink\'s performance will remain consistent over time.
The ATS-14H-142-C3-R0 is ideal for applications requiring high efficiency heat transfer such as in electronic components, computers, medical devices, and more. Its low profile and enclosed mounting holes make it easy to integrate into smaller spaces. The heat sink also features easy installation with no mounting tools required. It is designed to be mounted on either side of the mounting hole for easy installation and removal.
The working principle of the ATS-14H-142-C3-R0 is based on thermodynamic principles. Heat is generated by electricity flowing through components, and a heat sink is used to dissipate the heat. Heat always moves from a higher temperature to a lower temperature. When a heat sink is mounted directly onto a component, heat is efficiently transferred away from the component. The fins of the heat sink act as a large surface area, allowing for efficient heat dissipation.
The heat sink is designed to be cooler than the component in order to effectively draw the heat away. The cooler air helps remove the heat from the component, allowing the component to remain cool. The air then dissipates the heat into the surrounding environment. As the air passes over the fins, the heat is gradually transferred and dissipated into the environment.
The ATS-14H-142-C3-R0 is designed to provide high-efficiency heat transfer. The low profile design and enclosed mounting holes make it easy to integrate into any application. With its long-lasting construction and easy installation, this thermal heat sink is the perfect solution for applications requiring high-efficiency heat transfer.
The specific data is subject to PDF, and the above content is for reference