| Allicdata Part #: | ATS-14H-17-C3-R0-ND |
| Manufacturer Part#: |
ATS-14H-17-C3-R0 |
| Price: | $ 4.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14H-17-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.80520 |
| 30 +: | $ 3.59415 |
| 50 +: | $ 3.38260 |
| 100 +: | $ 3.17123 |
| 250 +: | $ 2.95982 |
| 500 +: | $ 2.74840 |
| 1000 +: | $ 2.69555 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an important component of any heat management system. They are essential in cooling both electronics and high-powered electric components/devices. The ATS-14H-17-C3-R0 is a type of heat sink designed for a wide variety of applications with a number of advantages. This article explains the application fields and working principles of the ATS-14H-17-C3-R0.
Applications of ATS-14H-17-C3-R0
The ATS-14H-17-C3-R0 is a high performance heat sink designed to be used in a variety of applications. It is ideal for applications where space and weight must be kept to a minimum. It is suitable for use with miniature and mobility electronic products, such as cell phones, personal digital assistants (PDAs), notebook PCs, power supplies and others. The ATS-14H-17-C3-R0 is particularly well suited to be used in dense electronic packaging applications where the use of a bigger or thicker heat sink is not practical.
The ATS-14H-17-C3-R0 heat sink is also suitable for use in a variety of power applications. It is capable of dissipating significant levels of heat while keeping the temperature of the device it is cooling at a safe and stable level. These heat sinks are suited to be used in high-power LED lighting, DC/DC converters, and other power electronic equipment. The high thermal performance of the ATS-14H-17-C3-R0 is also suitable for application as a heatsink for power semiconductor packages.
Working Principle of ATS-14H-17-C3-R0
The working principle of the ATS-14H-17-C3-R0 is based on natural convection. This means that the heat from the device is transferred to the heat sink via a natural air circulation and the laws of thermodynamics. Natural convection is the most efficient method of thermal transfer, as the heat is drawn away from the device with minimal power consumption. This is especially important in low-power applications, where efficiency is essential.
The ATS-14H-17-C3-R0 utilizes a pin fin design to maximize the surface area of the heat sink, allowing it to transfer more heat. This type of design also helps to reduce the acoustic noise generated as a result of vibration caused by the airflow. The design also has a number of other benefits, such as protection against corrosion and oxidation.
In addition to natural convection, the ATS-14H-17-C3-R0 can also be used in conjunction with forced convection techniques, such as air or liquid cooling. This can help to increase the thermal performance of the heat sink. The air or liquid can be supplied by a fan or a pump, respectively.
Conclusion
The ATS-14H-17-C3-R0 is a high performance heat sink designed for a variety of applications. It is suitable for use with miniature and mobility electronic products, power supplies, high-power LED lighting, DC/DC converters and other power electronic equipment. The high thermal performance of the ATS-14H-17-C3-R0 is based on natural convection, utilizing a pin fin design for maximal surface area and minimal acoustic noise. It can also be used in conjunction with forced convection techniques, such as air or liquid cooling.
The specific data is subject to PDF, and the above content is for reference