| Allicdata Part #: | ATS-14H-173-C3-R0-ND |
| Manufacturer Part#: |
ATS-14H-173-C3-R0 |
| Price: | $ 3.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14H-173-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.44673 |
| 30 +: | $ 3.25542 |
| 50 +: | $ 3.06394 |
| 100 +: | $ 2.87242 |
| 250 +: | $ 2.68093 |
| 500 +: | $ 2.48943 |
| 1000 +: | $ 2.44156 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is critical for ensuring the longevity and performance of electronic devices. Heat sinks, such as the ATS-14H-173-C3-R0, are one of the most widely used solutions for controlling and dissipating the generated heat away from the device.
What is the ATS-14H-173-C3-R0?
The ATS-14H-173-C3-R0 is a heat sink designed for designs using thermoelectric coolers (TECs) and other high wattage devices. It has an excellent surface flatness tolerance, along with a low profile which makes it easy to install in tight spaces. It features a rigid, plate-like design, with pre-installed screws, for easy and secure mounting on various heat-generating devices.
Application Field
The ATS-14H-173-C3-R0 is ideal for devices that require a high degree of thermal control, such as CPUs, GPUs, and high wattage FPGAs. It is also suitable for demanding applications, such as telecom systems, military applications, and medical equipment. It also works well for applications that require a noise-free environment, as this heat sink operates silently.
Working Principle
The working principle of the ATS-14H-173-C3-R0 is based on large surface area-to-volume ratio, which enables efficient dissipation of heat away from the heat generating device. The heat is dissipated through the fins which increase the surface area in contact with the surrounding air. This helps make the heat sink more efficient at dissipating the heat away from the device. The heat sink also utilizes heat pipes which help conduct the heat away from the source and out into the atmosphere.
In addition, the heat sink also features an advanced thermal pad design. This design helps to improve the interface between the heat sink and the heat-generating device, resulting in higher transfer of heat from the device to the heat sink.
Benefits
The ATS-14H-173-C3-R0 offers several benefits, including:
- High performance: The large fin area and high conductivity materials used in the design of the heat sink ensure excellent heat dissipation performance.
- Low profile: The low profile design of the heat sink makes it easy to install in tight spaces.
- Silent operation: The heat sink is designed to operate without any audible noise.
- Versatility: The heat sink can be used in a wide range of applications.
Conclusion
The ATS-14H-173-C3-R0 is a reliable and efficient heat sink used for controlling the temperature of electronic devices. It offers excellent heat dissipation performance, thanks to its large fin area and heat pipe design. It also has a low profile design, enabling easy installation in tight spaces, and operates silently. The heat sink is suitable for a wide range of applications, from CPU and GPU cooling to military applications.
The specific data is subject to PDF, and the above content is for reference