Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.86°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are a type of semiconductor which are designed to dissipate heat away from critical components. ATS-14H-197-C1-R0 is a good example of such Heat Sinks which can be used in many applications. This article will discuss the application field and working principle of this particular Heat Sink.

Application Field for ATS-14H-197-C1-R0

ATS-14H-197-C1-R0 Heat Sink is suitable for use in various applications including computer and office equipment, industrial control systems, home appliances, medical equipment, lighting, and automotive electronics.The Heat Sink is designed for use with integrated circuits, transistors and MOSFETs, microprocessors, power amplifiers, power converters, power supplies, and anything that produces a lot of heat.

Design and Construction

The ATS-14H-197-C1-R0 Heat Sink is constructed of aluminum and is designed to provide a low thermal resistance for reliable heat dissipation. The construction is designed to provide excellent strength and durability. The Heat Sink features an asymmetrical design with a deepe R0angle, which allows it to be installed in tight spaces, such as boards with limited space.

Working Principle

The ATS-14H-197-C1-R0 Heat Sink utilizes natural convection to dissipate heat away from the critical components. The principle works by having a thermal gradient created between the Heat Sink and the surrounding environment. Warm air is drawn in from the bottom of the Heat Sink and passes through the fins. This warm air then rises, carrying the heat away from the component and out of the top of the Heat Sink. This creates a continuous, uniform air flow in and around the device, allowing for efficient and effective heat dissipation.

Conclusion

The ATS-14H-197-C1-R0 Heat Sink is an excellent choice for a variety of applications. It is designed for use with integrated circuits, transistors and MOSFETs, microprocessors, power amplifiers, power converters, power supplies, and anything that produces a lot of heat. The Heat Sink utilizes natural convection to dissipate heat away from the critical components, allowing for efficient and effective heat dissipation.

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