| Allicdata Part #: | ATS-14H-205-C1-R0-ND |
| Manufacturer Part#: |
ATS-14H-205-C1-R0 |
| Price: | $ 3.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X6MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14H-205-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.34026 |
| 30 +: | $ 3.25017 |
| 50 +: | $ 3.06974 |
| 100 +: | $ 2.88912 |
| 250 +: | $ 2.70857 |
| 500 +: | $ 2.61828 |
| 1000 +: | $ 2.34741 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.98°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks, simply known as a "heat sink", is physical components used to regulate temperature levels in electronic devices. The common purpose of a heat sink is to dissipate the excess heat generated by the electrical power components and diverge the heat to ambient temperatures. This allows the device to remain at a desired operational temperature while maintaining efficiency and reliable operation. The ATS-14H-205-C1-R0 is commonly used as a heat sink in a variety of applications since its shape is best suited for both conventional and more advanced cooling needs.
The ATS-14H-205-C1-R0 is specifically designed for medium-sized applications such as telecommunications and networking systems, power stations, and semiconductor production lines. The heat sink itself is constructed of a graphite-filled aluminum extruded body with five cooling fins in an easy-to-install form factor. This design allows for increased heat dissipation and excellent thermal insulation. The fins are highly conductive, capable of assisting with the withdrawal of excess heat in the device. Furthermore, each fin has an integrated thermal-break feature that assures maximum cooling performance.
The ATS-14H-205-C1-R0 has a variety of features that make it highly attractive for applications, such as its large surface area that allows for efficient and rapid cooling. Its aluminum-filled construction is also very durable and is suitable for both indoor and outdoor use. Additionally, it is relatively lightweight and can be easily mounted onto almost any electronic device without additional support.
The ATS-14H-205-C1-R0’s most important feature is its working principle. The heat sink works by transferring heat between the device and the environment. This transfer occurs through infrared radiation and conduction. Infrared radiation is the direct transfer of heat from one surface to another and is responsible for the creation of convection currents. This convection current drives dissipated heat away from the device and helps to maintain the desired operational temperature. Conductive heat transfer occurs when the heat sink contacts the heat source directly. This allows the heat sink to absorb the heat generated by the device and reduce the temperature while providing additional insulation for the device.
The ATS-14H-205-C1-R0 is an extremely effective and versatile heat sink that can be used in a variety of applications. Its design and construction are perfect for medium-sized applications that require rapid heat dissipation and reliable thermal insulation. The heat sink works by transferring heat between the device and the environment, providing excellent cooling performance and keeping the device at the desired operational temperature.
The specific data is subject to PDF, and the above content is for reference