| Allicdata Part #: | ATS-14H-30-C3-R0-ND |
| Manufacturer Part#: |
ATS-14H-30-C3-R0 |
| Price: | $ 8.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14H-30-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 7.31934 |
| 30 +: | $ 6.88861 |
| 50 +: | $ 6.45813 |
| 100 +: | $ 6.02759 |
| 250 +: | $ 5.59705 |
| 500 +: | $ 5.48941 |
| 1000 +: | $ 5.38177 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions come in a wide variety of sizes, shapes, materials, and designs in order to meet the requirements of many different industries and applications. Heat sinks are one of the solutions available to dissipate the heat generated by electronics, and ATS-14H-30-C3-R0 is a commonly used version. In this article we will explore the application field and working principle of the ATS-14H-30-C3-R0.
ATS-14H-30-C3-R0 is designed for thermal management in medium and high-power density electronic devices, providing a combination of efficient cooling in a compact space. This heatsink is manufactured from extruded aluminum, and it features fluted fins and integral heat pipes for improved heat transfer. It can be mounted using custom designed clips or screws, and comes complete with a base plate, cover plate, and mounting hardware.
The ATS-14H-30-C3-R0 is ideal for applications that require effective cooling solutions in limited spaces, such as servers, medical devices, network equipment, and many more. The heatsink has a lower profile than other solutions, allowing it to be used in tight spaces without sacrificing thermal performance. It offers excellent heat dissipation, with a thermal resistance of 1.61°C/W and a thermal capacity of 57.83W at 70°C. It is also highly efficient, reaching up to 92% heat transfer efficiency at full load.
The ATS-14H-30-C3-R0 operates on the principle of heat transfer. Heat is generated from electronic components within the system and is transferred to the fins of the heatsink. The heat is then dissipated through convection to the surrounding air. The fins of the heatsink are designed to increase the surface area and make the transfer of heat more efficient. The integral heat pipes within the heatsink help to dissipate heat from the base plate to the fins, further improving the heat transfer rate.
The ATS-14H-30-C3-R0 is both durable and reliable, with a minimum service life of over 50,000 hours and a maximum operating temperature of 150°C. This heatsink is also RoHS and REACH compliant, making it suitable for a wide range of applications in various industries. It is also UL certified, for additional piece of mind.
In conclusion, the ATS-14H-30-C3-R0 is an efficient and reliable thermal solution for medium and high-power density electronic devices. It employs heat transfer technology to dissipate heat, while its compact size allows it to be used in limited spaces. It is also RoHS and REACH compliant, UL certified, and has a minimum service life of over 50,000 hours. This heatsink is an ideal solution for a variety of industries, from servers to medical devices and more.
The specific data is subject to PDF, and the above content is for reference