ATS-14H-42-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS-14H-42-C2-R0-ND

Manufacturer Part#:

ATS-14H-42-C2-R0

Price: $ 7.15
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X60.96X22.86MM T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-14H-42-C2-R0 datasheetATS-14H-42-C2-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 6.43104
30 +: $ 6.07383
50 +: $ 5.71662
100 +: $ 5.35928
250 +: $ 5.00200
500 +: $ 4.64471
1000 +: $ 4.55539
Stock 1000Can Ship Immediately
$ 7.15
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 2.400" (60.96mm)
Diameter: --
Height Off Base (Height of Fin): 0.900" (22.86mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.31°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management, in the context of electronics, is the use of various methods of cooling to maintain the proper temperature range for optimal operation and to prevent malfunctioning or degradation of performance. Heat sinks are devices used to dissipate heat away from the inside of an electronic product, often using forced air or water cooling. The ATS-14H-42-C2-R0 is a type of extruded aluminum heat sink that is available in different twist and clamp styles.

The ATS-14H-42-C2-R0 heat sink is typically used in applications that require a low profile solution such as telecommunications, embedded computers, and test and measurement equipment. Its unique design enables it to dissipate the heat away from the component and out from the surrounding environment. The ATS-14H-42-C2-R0 has a 42-millimeter profile height that allows it to fit into tight spaces. This allows for more efficient use of space as well as better protection of the components that it is cooling.

The ATS-14H-42-C2-R0 heat sink is designed with an advanced cooling method that ensures the component is not exposed to excessive heat. This makes it efficient in dissipating heat away from the component quickly. This cooling system also prevents the components from overheating. To do this, a layer of insulation is strategically placed between the actual device and the heat sink. This prevents the heat from transferring to the device and keeps the temperature of the device under control. An additional layer of insulation helps to ensure that the heat is distributed evenly around the component, thus maintaining an even temperature throughout the application.

In addition, the ATS-14H-42-C2-R0 heat sink is designed with an efficient clamping mechanism which allows the heat sink to securely fit onto the component without any obstructions. This design helps to make sure that the heat is drawn away from the component and evenly dissipated into the environment. This helps to ensure that components are not subject to excessive heat and temperature levels.

The ATS-14H-42-C2-R0 heat sink is an efficient solution for maintaining optimal temperatures for various applications. Its low profile design is ideal for tight spaces, distributing heat evenly throughout the component’s environment. The insulation layers combined with the clamping mechanism help to ensure the component is not subjected to excessive temperature levels. With its advanced cooling system, the ATS-14H-42-C2-R0 heat sink is a reliable solution for dissipating heat away from the component.

The specific data is subject to PDF, and the above content is for reference

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