| Allicdata Part #: | ATS-14H-63-C1-R0-ND |
| Manufacturer Part#: |
ATS-14H-63-C1-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14H-63-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-14H-63-C1-R0 is a thermal heat sink, which is used for managing heat generated by electronic components and circuits. It is especially suitable in high-density electronic applications where standard heat sinks are unable to dissipate heat efficiently. The ATS-14H-63-C1-R0 has an optimized combination of heat dissipation and thermal conductivity to maintain the temperature of the device and to ensure the longevity and stability of the device.
The heat dissipation design of the ATS-14H-63-C1-R0 is based on two heat transfer technologies – conduction and convection. The design involves utilizing an aluminum-rich alloy and a durable PCBA assembly. The aluminum-rich alloy allows the thermal heat sink to quickly absorb heat from the device, while the PCBA assembly dissipates the heat into the air surrounding the device. The combination of these two technologies enables the ATS-14H-63-C1-R0 to effectively manage the thermal profile of the device.
In addition, the ATS-14H-63-C1-R0 is also designed with an optimized heat transfer surface. The heat transfer surface consists of a layer of interconnected grooves and ridges. The grooves and ridges provide a greater surface area for heat to dissipate, which in turn enhances the efficiency of the heat dissipation process. The heat transfer surface also helps reduce the turbulence within the thermal environment, allowing the device to run more efficiently.
The ATS-14H-63-C1-R0 is suitable for a wide range of heat management applications, including medical, industrial, automotive, cellular, and more. In addition, the ATS-14H-63-C1-R0 is completely sealed, which prevents any escaping air from entering the thermal environment. This ensures that the device is properly maintained and is able to operat efficiently for extended periods of time.
The ATS-14H-63-C1-R0 thermal heat sink is an excellent option for managing the thermal profile of electronic components and circuits. It is lightweight and easy to install, making it ideal for a wide variety of high-density electronic applications. With its optimized design, the ATS-14H-63-C1-R0 is able to effectively manage and dissipate heat from the device, allowing it to operate at maximum efficiency.
The specific data is subject to PDF, and the above content is for reference