| Allicdata Part #: | ATS24814-ND |
| Manufacturer Part#: |
ATS-14H-97-C2-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14H-97-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.93750 |
| 10 +: | $ 3.82851 |
| 25 +: | $ 3.61595 |
| 50 +: | $ 3.40326 |
| 100 +: | $ 3.19051 |
| 250 +: | $ 2.97781 |
| 500 +: | $ 2.76511 |
| 1000 +: | $ 2.71193 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical component of modern electronics, and the successful operation of any given system is dependent on the ability to confidently disperse the heat generated by these systems. Heat sinks are an important part of a system’s thermal management strategy, and ATS-14H-97-C2-R0 has been designed specifically to address the cooling needs of some of the more compact electronic systems.
ATS-14H-97-C2-R0 is a thermally conductive heat sink featuring a low profile design providing an effective, yet discreet solution for the cooling of electronic components. The heat sink is constructed from a blend of aluminum alloys, making it both lightweight and robust. The anodized aluminum alloy base makes for reliable contact and heat transfer from the component to the heat sink, while the black anodized, extruded aluminum fins, uniformly spaced across the base of the sink, increases the overall surface area available for heat transfer.
The heat sink’s low profile design and slim fin layout make it an easy solution for tight spaces. With a height of just 1.4” and a width of 4.75”, as well as a standard fan mount of 77mm, ATS-14H-97-C2-R0 is well suited for applications requiring minimal footprint and space. The extruded aluminum fins maximize surface area available for heat transfer, reducing the component’s temperature to safe operating levels, while the base of the sink ensures that heat is dispersed efficiently across the fins, allowing the heat sink to operate at much lower temperatures than those of competing products.
The ATS-14H-97-C2-R0 Heat sink is intended for use with broadly varied electronic applications, such as industrial PCs, telecommunication devices, servers, and medical devices which require cooling during operation. Industrial PCs generally require extra cooling due to their high operating temperatures and extended operation times. Telecommunication devices, which also produce more heat than consumer electronics, require efficient heat transfer technologies. Moreover, servers and medical devices which operate in extreme environments may also benefit from the enhanced thermal performance of the ATS-14H-97-C2-R0.
To ensure safety and reliability, the ATS-14H-97-C2-R0 Heat Sink has been tested in compliance with rigorous industry standards. The heat sink has been proven to efficiently dissipate heat and remain within safe working temperatures, making it an ideal solution for applications where cooling fidelity is of paramount importance. Additionally, the metal alloy used to construct ATS-14H-97-C2-R0 is both lightweight and corrosion-resistant, making it the perfect choice for long-term applications.
In summary, ATS-14H-97-C2-R0 has been designed to provide a reliable, effective, and discreet solution for the cooling of compact electronic systems. With its slim profile, lightweight design, and efficient heat dissipation, ATS-14H-97-C2-R0 is an ideal choice for industrial, telecommunications, server, and medical applications where space is at a premium.
The specific data is subject to PDF, and the above content is for reference