ATS-15A-100-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.69°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to the ATS-15A-100-C1-R0 Thermal-Heat Sink

The ATS-15A-100-C1-R0 Thermal-Heat Sink is a widely used component in a range of applications that require thermal management. It is an important heat dissipation component for a variety of electronics and mechanical components, and is designed to provide maximum cooling efficiency. This article will provide an overview of the key features of the ATS-15A-100-C1-R0 Thermal-Heat Sink, and an in depth look at its application fields and working principle.

Overview of the ATS-15A-100-C1-R0 Thermal-Heat Sink

The ATS-15A-100-C1-R0 Thermal-Heat Sink is a flat panel heat sink measuring 17x17x1.2mm. It is made from aluminum alloy 6063 which provides excellent thermal conductivity and resistance to corrosion. The ATS-15A-100-C1-R0 Thermal-Heat Sink has a compact design, making it suitable for a range of applications. It is also light in weight and has a relatively low profile. The ATS-15A-100-C1-R0 Thermal-Heat Sink has a working temperature range of -55°C to +150°C and can handle a power output of up to 15A.

Application Fields and Working Principle of the ATS-15A-100-C1-R0 Thermal-Heat Sink

The ATS-15A-100-C1-R0 Thermal-Heat Sink is suitable for a range of applications which require effective thermal management. These include computers, medical equipment, automotive electronics, consumer electronics and telecoms equipment. The ATS-15A-100-C1-R0 Thermal-Heat Sink is able to dissipate heat from a variety of electronic components, such as processors, LEDs and FETs.The ATS-15A-100-C1-R0 Thermal-Heat Sink utilises a simple but effective working principle. When heat is generated by an electronic device, it is transferred to the ATS-15A-100-C1-R0 Thermal-Heat Sink, which dissipates the heat by spreading it out in all directions over a large surface area. This helps to keep electronic devices cooler, improving their overall performance and prolonging their lifespan.

Conclusion

The ATS-15A-100-C1-R0 Thermal-Heat Sink is an ideal thermal management component for a range of applications which require effective heat dissipation. It is light in weight, has a compact design and can handle a power output of up to 15A. The ATS-15A-100-C1-R0 Thermal-Heat Sink utilises a simple but effective working principle which efficiently dissipates the heat produced by electronic devices, improving their overall performance and prolonging their lifespan.

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