| Allicdata Part #: | ATS-15A-110-C3-R1-ND |
| Manufacturer Part#: |
ATS-15A-110-C3-R1 |
| Price: | $ 5.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15A-110-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.73067 |
| 30 +: | $ 4.46796 |
| 50 +: | $ 4.20512 |
| 100 +: | $ 3.94235 |
| 250 +: | $ 3.67953 |
| 500 +: | $ 3.41671 |
| 1000 +: | $ 3.35100 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Leveraging heat sink technology to dissipate the heat in power devices is one of the most popular choices in the field of thermal management. The ATS-15A-110-C3-R1 is a heat sink series produced by a major manufacturer for this purpose. The ATS-15A-110-C3-R1 has a wide range of applications and operates with a specific working principle.
Application Field
The ATS-15A-110-C3-R1 heat sink is commonly used in a variety of electrical and electronics industries because it is designed to dissipate heat from switched-mode power supplies, ballasts, integrated circuits (ICs), converters, motor drives and other voltage controlled devices.
In addition to the electronics industry, the ATS-15A-110-C3-R1 heat sink can also be used in automotive, military, communication, industrial control, aerospace, and transportation industries that generate heat that needs to be managed.
Working Principle
The working principle of the ATS-15A-110-C3-R1 heat sink is based on the principle of thermal conductivity. Heat is generated inside electrical and electronics components as they work, and over time this heat can damage the devices. A heat sink is designed to absorb and dissipate this heat away from the device before it reaches critical levels.
The ATS-15A-110-C3-R1 heat sink consists of a fin stack with internal ribs that allow the heat to be transferred within the device. As the fins come in contact with the surrounding air, they absorb and dissipate the heat generated within the component. In addition, the ATS-15A-110-C3-R1 also features advanced fin geometry to ensure efficient heat transfer and reduce static pressure.
The ATS-15A-110-C3-R1 heat sink is also equipped with thermal pads to improve heat transfer between the component and the fin stack. As the pads absorb the heat generated within the component and transfer it to the fins, the fins dissipate the heat into the surrounding air. The fin geometry and density of the ATS-15A-110-C3-R1 ensures that the heat is efficiently dispersed.
The ATS-15A-110-C3-R1 heat sink series has also been designed to be lightweight and requires minimal installation time compared to other heat sink solutions. In addition, it is also able to support higher air flow rates which allows it to disperse heat more quickly and effectively.
Conclusion
The ATS-15A-110-C3-R1 heat sink series is a reliable solution that can be used in a variety of industries in order to dissipate the heat generated within electrical and electronics components. The heat sink works on the principle of thermal conductivity and features advanced fin geometry and thermal pads to ensure efficient and effective heat transfer. As the device is lightweight and quick to install, it is an ideal choice for a variety of applications that require efficient thermal management.
The specific data is subject to PDF, and the above content is for reference