| Allicdata Part #: | ATS-15A-112-C3-R1-ND |
| Manufacturer Part#: |
ATS-15A-112-C3-R1 |
| Price: | $ 6.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15A-112-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.76009 |
| 30 +: | $ 5.44026 |
| 50 +: | $ 5.12026 |
| 100 +: | $ 4.80022 |
| 250 +: | $ 4.48021 |
| 500 +: | $ 4.16019 |
| 1000 +: | $ 4.08019 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.38°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly important for electronic system designers as power levels per chip continue to increase. To further enhance performance, decrease power consumption, and extend the lifetime of a device, thermal management utilizes different solutions such as heat sinks, forced air cooling, liquid cooling, and heat pipes. Among these solutions, heat sinks have become the most widely used solution since they are relatively low cost, easy to implement and maintain. In this article, we will take a closer look at the ATS-15A-112-C3-R1, a heat sink specifically designed for high-power applications.
The ATS-15A-112-C3-R1 is designed for applications that require an active cooling solution. It features a unique fin design that optimizes the heat transfer between the solid surface and the heat dissipating air. It is made of aluminum, which is a good thermal conductor. The ATS-15A-112-C3-R1 has a large surface area to maximize the heat dissipation.
The ATS-15A-112-C3-R1 is designed for high power applications, such as dies, CPUs, GPUs, FPGAs, and power amplifiers. It is rated for 120 watts thermal transfer and can be mounted horizontally or vertically, depending on the configuration of the device to be cooled. The heat sink is also capable of dissipating a wide range of temperatures and heat flows, from 15 to 110°C. This makes it ideal for demanding applications where temperatures are high before a heat sink is applied.
The working principle of the ATS-15A-112-C3-R1 is based on convective heat transfer. The heat generated by the components is transferred to the heat sink through conduction and then dissipated to the ambient air surrounding the device through convection. The heat sink is designed to maximize the surface area exposed to air, and this ensures that the heat is dissipated quickly and efficiently.
In order to maximize the performance of the ATS-15A-112-C3-R1, the air flow around the device needs to be optimized. This can be done by adding additional fans or ventilation holes to the case. If possible, the device should also be placed in an area that does not experience excessively high ambient temperatures. The heat sink should also be kept away from sources of high electromagnetic interference, as this can affect its performance.
The ATS-15A-112-C3-R1 is an efficient and reliable thermal management solution for high power applications. It is easy to install and maintain, and it delivers optimal performance when properly utilized. By understanding the application field and working principle of the ATS-15A-112-C3-R1, designers can easily integrate this device into their designs, thus ensuring optimal thermal management performance.
The specific data is subject to PDF, and the above content is for reference