Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are designed to dissipate heat away from the surface of a device or component and into the surrounding air. ATS-15A-140-C3-R0 is a type of thermal heat sink that’s ideal for applications where the primary concern is to dissipate heat as quickly as possible.

Application Field of ATS-15A-140-C3-R0

ATS-15A-140-C3-R0 is a thermal heat sink suitable for applications requiring a high level of cooling performance. This heat sink has an optimized fin design that provides superior cooling performance by increasing the rate of heat transfer from the base material to the air. Its compact design also allows for use in limited spaces, making it a great choice for applications where size and weight are primary concerns.

The primary application of ATS-15A-140-C3-R0 is cooling of high-powered electronics. Due to its high-performance design, this thermal heat sink is highly effective at managing the heat produced by components such as CPUs, GPUs, power supplies, and many others. It’s also suitable for high-power applications such as automotive electronics, defense applications, and industrial automation.

The unique design of ATS-15A-140-C3-R0 also makes it ideal for applications requiring low weight and low profile. This heat sink only has a height of 15.3mm, and its weight is only 140g, making it an ideal choice for portable electronics, as well as applications where size constraints have to be met.

Working Principle of ATS-15A-140-C3-R0

The ATS-15A-140-C3-R0 features an optimized fin design that helps to increase the rate of heat transfer from the base material to the air. This is accomplished by using a two-stage cooling process – first, the fins help to direct the flow of air through the heat sink, and second, the fins act as a barrier that prevents the heat from dissipating too quickly.

The advanced design of the ATS-15A-140-C3-R0 helps to ensure that the heat is effectively transferred away from the device or component, without causing any damage to the substrate. The base is made of high-grade aluminum and designed to facilitate heat transfer quickly and efficiently. In addition, the fins are constructed from a unique material that helps to absorb and transfer heat away from the substrate quickly.

The ATS-15A-140-C3-R0 also features an airflow design that helps to increase the overall cooling performance of the heat sink. This design utilizes several components such as an air pressure regulator and a fan blade system to help direct airflow into the heat sink, which then helps to dissipate the heat away from the device or component. By using this system, the heat sink is able to maximize its performance, providing the best possible cooling performance for the application.

The ATS-15A-140-C3-R0 is a reliable and efficient thermal heat sink that is well-suited for applications where a high level of cooling performance is required. Its advanced design helps to dissipate heat away from the device or component quickly and efficiently, without causing any damage to the substrate. In addition, its optimized fin design and airflow system make it an ideal choice for applications that require a compact, lightweight, and low profile thermal heat sink.

The specific data is subject to PDF, and the above content is for reference