| Allicdata Part #: | ATS24887-ND |
| Manufacturer Part#: |
ATS-15A-155-C2-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15A-155-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.92490 |
| 10 +: | $ 3.81717 |
| 25 +: | $ 3.60511 |
| 50 +: | $ 3.39293 |
| 100 +: | $ 3.18087 |
| 250 +: | $ 2.96881 |
| 500 +: | $ 2.75675 |
| 1000 +: | $ 2.70374 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are becoming increasingly essential to ensure that electronic systems and components operate efficiently, reliably, and cost-effectively. The ATS-15A-155-C2-R0 is a reliable choice when selecting a standard-sized thermal heat sink for a wide range of small to mid-range applications. For smaller systems, the use of a full-sized thermal heat sink may not be necessary, as the limited cooling capacity and efficiency requirements in these configurations typically require a less efficient solution. This makes the ATS-15A-155-C2-R0 an ideal fit for many applications.
The ATS-15A-155-C2-R0 is a finned heat sink with an overall width of 0.18 inches (4.57mm) and an overall height of 0.56 inches (14.22mm). It uses a traditional design to dissipate heat from a device and is available in aluminum and copper. The use of different heat-sink materials to optimize cooling capacity is becoming more common as component manufacturers strive for greater efficiency. Additionally, the design of this thermal-heat sink maximizes its effective cooling area.
The ATS-15A-155-C2-R0 is suitable for both single- and multiple-chip applications. Its effective cooling capacity is rated up to 1.1W per chip. The optimal design of the fin geometry ensures even cooling of the entire surface area. The heat sink features a lightweight construction with pre-drilled mounting holes for easy installation. A wide variety of mounting hardware is also available, allowing for greater customization when installing this thermal-heat sink.
The working principle of the ATS-15A-155-C2-R0 thermal heat sink relies on heat transfer from a “hot” component to the cold case of the heat sink. The design of the fins provides a large surface area for improved heat dissipation, and the use of aluminum and copper materials further enhances the efficiency of the unit. One of the most important aspects for proper performance is proper airflow – typically between 0 to 24 SCFM – out of the sink in order to effectively pull heat away from the component and into the finned surface of the heat sink.
The ATS-15A-155-C2-R0 thermal heat sink is a versatile and effective cooling solution for smaller applications. Its optimal design is able to handle up to 1.1 Watts per chip, while its aluminum and copper construction provides improved thermal performance. Additionally, the unit is designed to easily integrate into both single- and multiple-chip applications, and a wide variety of mounting hardware is available to customize the installation.
The specific data is subject to PDF, and the above content is for reference