ATS-15A-16-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.14°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

ATS-15A-16-C3-R0 is a specialized thermal-heat sink designed for the efficient transfer and dissipation of heat generated from a power source. It is made using a combination of aluminum and copper materials, which provide superior heat transfer and dissipation capabilities. This makes it suitable for a wide range of applications, including computer, industrial, and consumer electronics. This article will discuss the application field and working principle of the ATS-15A-16-C3-R0.

Application Field

The ATS-15A-16-C3-R0 is designed for a broad range of applications, including computer, industrial, and consumer electronics. It is particularly useful in applications that produce a great deal of heat, such as high power computers, electronic goods production lines, and consumer electronics. The heat sinks are easily customized to fit any application, and can easily be built directly onto circuit boards and components for an efficient and cost-effective cooling solution. The ATS-15A-16-C3-R0 is also highly resistant to corrosion, making it an ideal choice for environments that experience a high amount of moisture or condensation. Additionally, the heat sink can withstand temperatures up to 150°C, making it suitable for a wide range of applications. Thanks to its durability and long lasting performance, the ATS-15A-16-C3-R0 is a great choice for any application where cooling efficiency is a priority.

Working Principle

The ATS-15A-16-C3-R0 utilizes an advanced combination of aluminum and copper to form an efficient heat transfer and dissipation structure. The aluminum core of the heat sink is manufactured using an innovative extrusion process, giving it a high strength and heat dissipation rate. The copper fins on the heat sink are designed to maximize surface area, ensuring a maximum amount of heat transfer and dissipation.The ATS-15A-16-C3-R0 uses an ultra-thin copper layer to bridge the gap between the aluminum core and copper fins. This layer increases the heat transfer rate between the two materials, resulting in a much more efficient cooling process. Additionally, the fins have been specially designed to minimize air turbulence, further improving the heat dissipation rate.When the ATS-15A-16-C3-R0 is used as part of a cooling system, it functions by transferring and dissipating the heat absorbed by the aluminum core to its surrounding environment. Thanks to its high surface area and improved heat transfer rate, the system is significantly more efficient than other cooling systems. Additionally, the aluminum core and copper fins act as an excellent thermal conductor, ensuring that the heat is spread evenly throughout the area.

Conclusion

The ATS-15A-16-C3-R0 is a highly efficient thermal-heat sink, designed to quickly and efficiently transfer and dissipate heat from power sources. Its combination of aluminum and copper provides superior heat transfer and dissipation capabilities, making it suitable for a wide range of applications. The ATS-15A-16-C3-R0 is highly resistant to corrosion, and can withstand temperatures up to 150°C. Additionally, its innovative design ensures optimal heat transfer and dissipation rates. With its durability and long lasting performance, the ATS-15A-16-C3-R0 is an ideal choice for any application where cooling efficiency is a priority.

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